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Wide Bandgap Power Semiconductor Packaging

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Wide Bandgap Power Semiconductor Packaging

Wide Bandgap Power Semiconductor Packaging Book
Author : Katsuaki Suganuma
Publisher : Woodhead Publishing
Release : 2018-05-28
ISBN : 0081020953
Language : En, Es, Fr & De

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Book Description :

Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability addresses the key challenges that WBG power semiconductors face during integration, including heat resistance, heat dissipation and thermal stress, noise reduction at high frequency and discrete components, and challenges in interfacing, metallization, plating, bonding and wiring. Experts on the topic present the latest research on materials, components and methods of reliability and evaluation for WBG power semiconductors and suggest solutions to pave the way for integration. As wide bandgap (WBG) power semiconductors, SiC and GaN, are the latest promising electric conversion devices because of their excellent features, such as high breakdown voltage, high frequency capability, and high heat-resistance beyond 200 C, this book is a timely resource on the topic. Examines the key challenges of wide bandgap power semiconductor packaging at various levels, including materials, components and device performance Provides the latest research on potential solutions, with an eye towards the end goal of system integration Discusses key problems, such as thermal management, noise reduction, challenges in interconnects and substrates

High Voltage Packaging Technology for Wide Bandgap Power Semiconductor Devices

High Voltage Packaging Technology for Wide Bandgap Power Semiconductor Devices Book
Author : Suhail Jeremy Rashid
Publisher : Unknown
Release : 2008
ISBN : 0987650XXX
Language : En, Es, Fr & De

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Book Description :

Download High Voltage Packaging Technology for Wide Bandgap Power Semiconductor Devices book written by Suhail Jeremy Rashid, available in PDF, EPUB, and Kindle, or read full book online anywhere and anytime. Compatible with any devices.

Wide Bandgap Semiconductor Power Devices

Wide Bandgap Semiconductor Power Devices Book
Author : B. Jayant Baliga
Publisher : Woodhead Publishing
Release : 2018-10-17
ISBN : 0081023073
Language : En, Es, Fr & De

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Book Description :

Wide Bandgap Semiconductor Power Devices: Materials, Physics, Design and Applications provides readers with a single resource on why these devices are superior to existing silicon devices. The book lays the groundwork for an understanding of an array of applications and anticipated benefits in energy savings. Authored by the Founder of the Power Semiconductor Research Center at North Carolina State University (and creator of the IGBT device), Dr. B. Jayant Baliga is one of the highest regarded experts in the field. He thus leads this team who comprehensively review the materials, device physics, design considerations and relevant applications discussed. Comprehensively covers power electronic devices, including materials (both gallium nitride and silicon carbide), physics, design considerations, and the most promising applications Addresses the key challenges towards the realization of wide bandgap power electronic devices, including materials defects, performance and reliability Provides the benefits of wide bandgap semiconductors, including opportunities for cost reduction and social impact

Disruptive Wide Bandgap Semiconductors Related Technologies and Their Applications

Disruptive Wide Bandgap Semiconductors  Related Technologies  and Their Applications Book
Author : Yogesh Kumar Sharma
Publisher : BoD – Books on Demand
Release : 2018-09-12
ISBN : 1789236681
Language : En, Es, Fr & De

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Book Description :

SiC and GaN devices have been around for some time. The first dedicated international conference on SiC and related devices, "ICSCRM," was held in Washington, DC, in 1987. But only recently, the commercialization of SiC and GaN devices has happened. Due to its material properties, Si as a semiconductor has limitations in high-temperature, high-voltage, and high-frequency regimes. With the help of SiC and GaN devices, it is possible to realize more efficient power systems. Devices manufactured from SiC and GaN have already been impacting different areas with their ability to outperform Si devices. Some of the examples are the telecommunications, automotive/locomotive, power, and renewable energy industries. To achieve the carbon emission targets set by different countries, it is inevitable to use these new technologies. This book attempts to cover all the important facets related to wide bandgap semiconductor technology, including new challenges posed by it. This book is intended for graduate students, researchers, engineers, and technology experts who have been working in the exciting fields of SiC and GaN power devices.

Thermal and Electro Thermal System Simulation

Thermal and Electro Thermal System Simulation Book
Author : Márta Rencz,Lorenzo Codecasa
Publisher : MDPI
Release : 2019-11-18
ISBN : 3039217364
Language : En, Es, Fr & De

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Book Description :

With increasing power levels and power densities in electronics systems, thermal issues are becoming more and more critical. The elevated temperatures result in changing electrical system parameters, changing the operation of devices, and sometimes even the destruction of devices. To prevent this, the thermal behavior has to be considered in the design phase. This can be done with thermal end electro-thermal design and simulation tools. This Special Issue of Energies, edited by two well-known experts of the field, Prof. Marta Rencz, Budapest University of Technology and Economics, and by Prof. Lorenzo Codecasa, Politecnico di Milano, collects twelve papers carefully selected for the representation of the latest results in thermal and electro-thermal system simulation. These contributions present a good survey of the latest results in one of the most topical areas in the field of electronics: The thermal and electro-thermal simulation of electronic components and systems. Several papers of this issue are extended versions of papers presented at the THERMINIC 2018 Workshop, held in Stockholm in the fall of 2018. The papers presented here deal with modeling and simulation of state-of-the-art applications that are highly critical from the thermal point of view, and around which there is great research activity in both industry and academia. Contributions covered the thermal simulation of electronic packages, electro-thermal advanced modeling in power electronics, multi-physics modeling and simulation of LEDs, and the characterization of interface materials, among other subjects.

Semiconductor Power Devices

Semiconductor Power Devices Book
Author : Josef Lutz,Heinrich Schlangenotto,Uwe Scheuermann,Rik De Doncker
Publisher : Springer
Release : 2018-02-16
ISBN : 3319709178
Language : En, Es, Fr & De

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Book Description :

Halbleiter-Leistungsbauelemente sind das Kernstück der Leistungselektronik. Sie bestimmen die Leistungsfähigkeit und machen neuartige und verlustarme Schaltungen erst möglich. In dem Band wird neben den Halbleiter-Leistungsbauelementen selbst auch die Aufbau- und Verbindungstechnik behandelt: von den physikalischen Grundlagen und der Herstellungstechnologie über einzelne Bauelemente bis zu thermomechanischen Problemen, Zerstörungsmechanismen und Störungseffekten. Die 2., überarbeitete Auflage berücksichtigt technische Neuerungen und Entwicklungen.

Compound Semiconductor

Compound Semiconductor Book
Author : Anonim
Publisher : Unknown
Release : 2003
ISBN : 0987650XXX
Language : En, Es, Fr & De

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Book Description :

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State of the Art Program on Compound Semiconductors 49 SOTAPOCS 49 and Nitrides and Wide Bandgap Semiconductors for Sensors Photonics and Electronics 9

State of the Art Program on Compound Semiconductors 49  SOTAPOCS 49   and  Nitrides and Wide Bandgap Semiconductors for Sensors  Photonics  and Electronics 9 Book
Author : J. Wang
Publisher : The Electrochemical Society
Release : 2008-10
ISBN : 1566776538
Language : En, Es, Fr & De

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Book Description :

This issue of ECS Transactions focuses on issues pertinent to materials growth, characterization, processing, development, application of compound semiconductor materials and devices, including nitrides and wide-bandgap semiconductors.

Proceedings 2003

Proceedings 2003 Book
Author : Semiconductor Thermal Measurement and Management Symposium
Publisher : Unknown
Release : 2003
ISBN : 9780780377936
Language : En, Es, Fr & De

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Book Description :

Download Proceedings 2003 book written by Semiconductor Thermal Measurement and Management Symposium, available in PDF, EPUB, and Kindle, or read full book online anywhere and anytime. Compatible with any devices.

Electronic Design

Electronic Design Book
Author : Anonim
Publisher : Unknown
Release : 1994
ISBN : 0987650XXX
Language : En, Es, Fr & De

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Book Description :

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Proceedings 2001

Proceedings 2001 Book
Author : Bruce Romenesko,International Microelectronics and Packaging Society,Society of Photo-optical Instrumentation Engineers
Publisher : Unknown
Release : 2001
ISBN : 0987650XXX
Language : En, Es, Fr & De

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Book Description :

Download Proceedings 2001 book written by Bruce Romenesko,International Microelectronics and Packaging Society,Society of Photo-optical Instrumentation Engineers, available in PDF, EPUB, and Kindle, or read full book online anywhere and anytime. Compatible with any devices.

Proceedings of the International Symposium on Microelectronics

Proceedings of the     International Symposium on Microelectronics Book
Author : Anonim
Publisher : Unknown
Release : 2002
ISBN : 0987650XXX
Language : En, Es, Fr & De

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Book Description :

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Electronic Packaging Materials Science X Volume 515

Electronic Packaging Materials Science X  Volume 515 Book
Author : Daniel J. Belton,M. Gaynes,E. G. Jacobs,R. Pearson,Tien Wu
Publisher : Mrs Proceedings
Release : 1998-10
ISBN : 0987650XXX
Language : En, Es, Fr & De

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Book Description :

Proceedings of the April 1998 symposium, which focused on high-density package solutions, with an emphasis on flip-chip technology. Topics include interfacial adhesion behavior, flip-chip interconnections, high-density substrates, thermomechanical behavior, and packaging reliability issues. Articles address the fracture of polymer interfaces and the delamination tendencies seen with flip-chip interconnections on organic substrates, under-bump metallurgy issues, and overall reliability issues. Annotation copyrighted by Book News, Inc., Portland, OR

On the Accuracy of Impedance Measurements and the Influence of Fixturing

On the Accuracy of Impedance Measurements and the Influence of Fixturing Book
Author : Brian Taylor DeBoi
Publisher : Unknown
Release : 2019
ISBN : 0987650XXX
Language : En, Es, Fr & De

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Book Description :

Making accurate impedance measurements is a necessity when developing models for modern power electronics systems. Creating models of power electronic circuits involving wide bandgap devices requires characterizing the parasitic impedance of the semiconductor packaging, such as multi-chip power modules. Impedance analyzers are one commercially available instrument for quantifying these parasitics across frequency. Unfortunately, power semiconductor packages have various and often complex geometries; many devices can only be measured accurately using custom fixtures. All fixtures introduce systematic error into measurements, and failure to quantify the error of custom fixtures can lead to over-estimation of measurement accuracy. This thesis presents a measurement-based methodology for quantifying the error introduced by custom fixtures. This approach is validated through comparisons involving a commercially available test fixture with published error values. The contributions of the error are analyzed to custom fixtures and measurement techniques for low-impedance measurands. To this end, a method of external compensation is proposed. This technique is used to evaluate the relationship between fixture parasitics, measurand impedance, and fixture-induced measurement error. The result of this analysis is that, while increased fixture parasitics do increase the potential for error, the primary contribution to measurement error is the consistency of the measurement setup between compensation and measurement.

Microwave Journal

Microwave Journal Book
Author : Anonim
Publisher : Unknown
Release : 2007
ISBN : 0987650XXX
Language : En, Es, Fr & De

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ISPSD 01

ISPSD 01 Book
Author : Anonim
Publisher : Inst of Electrical Engineers of
Release : 2001
ISBN : 9784886860569
Language : En, Es, Fr & De

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Directory of Published Proceedings

Directory of Published Proceedings Book
Author : Anonim
Publisher : Unknown
Release : 2001
ISBN : 0987650XXX
Language : En, Es, Fr & De

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International Symposium on Advanced Packaging Materials

International Symposium on Advanced Packaging Materials Book
Author : Anonim
Publisher : Unknown
Release : 2005
ISBN : 0987650XXX
Language : En, Es, Fr & De

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Book Description :

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