Skip to main content

Wide Bandgap Power Semiconductor Packaging

In Order to Read Online or Download Wide Bandgap Power Semiconductor Packaging Full eBooks in PDF, EPUB, Tuebl and Mobi you need to create a Free account. Get any books you like and read everywhere you want. Fast Download Speed ~ Commercial & Ad Free. We cannot guarantee that every book is in the library!

Wide Bandgap Power Semiconductor Packaging

Wide Bandgap Power Semiconductor Packaging Book
Author : Katsuaki Suganuma
Publisher : Woodhead Publishing
Release : 2018-06-13
ISBN : 9780081020944
Language : En, Es, Fr & De

GET BOOK

Book Description :

Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability addresses the key challenges that WBG power semiconductors face during integration, including heat resistance, heat dissipation and thermal stress, noise reduction at high frequency and discrete components, and challenges in interfacing, metallization, plating, bonding and wiring. Experts on the topic present the latest research on materials, components and methods of reliability and evaluation for WBG power semiconductors and suggest solutions to pave the way for integration. As wide bandgap (WBG) power semiconductors, SiC and GaN, are the latest promising electric conversion devices because of their excellent features, such as high breakdown voltage, high frequency capability, and high heat-resistance beyond 200 C, this book is a timely resource on the topic. Examines the key challenges of wide bandgap power semiconductor packaging at various levels, including materials, components and device performance Provides the latest research on potential solutions, with an eye towards the end goal of system integration Discusses key problems, such as thermal management, noise reduction, challenges in interconnects and substrates

Wide Bandgap Power Semiconductor Packaging

Wide Bandgap Power Semiconductor Packaging Book
Author : Katsuaki Suganuma
Publisher : Woodhead Publishing
Release : 2018-05-28
ISBN : 0081020953
Language : En, Es, Fr & De

GET BOOK

Book Description :

Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability addresses the key challenges that WBG power semiconductors face during integration, including heat resistance, heat dissipation and thermal stress, noise reduction at high frequency and discrete components, and challenges in interfacing, metallization, plating, bonding and wiring. Experts on the topic present the latest research on materials, components and methods of reliability and evaluation for WBG power semiconductors and suggest solutions to pave the way for integration. As wide bandgap (WBG) power semiconductors, SiC and GaN, are the latest promising electric conversion devices because of their excellent features, such as high breakdown voltage, high frequency capability, and high heat-resistance beyond 200 C, this book is a timely resource on the topic. Examines the key challenges of wide bandgap power semiconductor packaging at various levels, including materials, components and device performance Provides the latest research on potential solutions, with an eye towards the end goal of system integration Discusses key problems, such as thermal management, noise reduction, challenges in interconnects and substrates

High Voltage Packaging Technology for Wide Bandgap Power Semiconductor Devices

High Voltage Packaging Technology for Wide Bandgap Power Semiconductor Devices Book
Author : Suhail Jeremy Rashid
Publisher : Unknown
Release : 2008
ISBN : 0987650XXX
Language : En, Es, Fr & De

GET BOOK

Book Description :

Download High Voltage Packaging Technology for Wide Bandgap Power Semiconductor Devices book written by Suhail Jeremy Rashid, available in PDF, EPUB, and Kindle, or read full book online anywhere and anytime. Compatible with any devices.

Wide Bandgap Semiconductor Power Devices

Wide Bandgap Semiconductor Power Devices Book
Author : B. Jayant Baliga
Publisher : Woodhead Publishing
Release : 2018-10-17
ISBN : 0081023073
Language : En, Es, Fr & De

GET BOOK

Book Description :

Wide Bandgap Semiconductor Power Devices: Materials, Physics, Design and Applications provides readers with a single resource on why these devices are superior to existing silicon devices. The book lays the groundwork for an understanding of an array of applications and anticipated benefits in energy savings. Authored by the Founder of the Power Semiconductor Research Center at North Carolina State University (and creator of the IGBT device), Dr. B. Jayant Baliga is one of the highest regarded experts in the field. He thus leads this team who comprehensively review the materials, device physics, design considerations and relevant applications discussed. Comprehensively covers power electronic devices, including materials (both gallium nitride and silicon carbide), physics, design considerations, and the most promising applications Addresses the key challenges towards the realization of wide bandgap power electronic devices, including materials defects, performance and reliability Provides the benefits of wide bandgap semiconductors, including opportunities for cost reduction and social impact

High Performance Packaging Technology for Wide Bandgap Semiconductor Modules

High Performance Packaging Technology for Wide Bandgap Semiconductor Modules Book
Author : Paul Mumby-Croft
Publisher : Unknown
Release : 2018
ISBN : 0987650XXX
Language : En, Es, Fr & De

GET BOOK

Book Description :

The properties of wide band gap (WBG) semiconductors are beneficial to power electronics applications ranging from consumer electronics and renewable energy to electric vehicles and high-power traction applications like high-speed trains. WBG devices, properly integrated, will allow power electronics systems to be smaller, lighter, operate at higher temperatures, and at higher frequencies than previous generations of Si-based systems. These will contribute to higher efficiency, and therefore, lower lifecycle costs and lower CO2 emissions. Over 20 years have been spent developing WBG materials, low-defect-density wafers, epitaxy, and device fabrication and processing technology. In power electronics applications, devices are normally packaged into large integrated modules with electrical, mechanical and thermal connection to the system and control circuit. The first generations of WBG device have used conventional or existing module designs to allow drop-in replacement of Si devices; this approach limits the potential benefit. To realize the full potential of WBG devices, especially the higher operating temperatures and faster switching frequency, a new generation of packaging design and technology concepts must be widely implemented.

Disruptive Wide Bandgap Semiconductors Related Technologies and Their Applications

Disruptive Wide Bandgap Semiconductors  Related Technologies  and Their Applications Book
Author : Yogesh Kumar Sharma
Publisher : BoD – Books on Demand
Release : 2018-09-12
ISBN : 1789236681
Language : En, Es, Fr & De

GET BOOK

Book Description :

SiC and GaN devices have been around for some time. The first dedicated international conference on SiC and related devices, "ICSCRM," was held in Washington, DC, in 1987. But only recently, the commercialization of SiC and GaN devices has happened. Due to its material properties, Si as a semiconductor has limitations in high-temperature, high-voltage, and high-frequency regimes. With the help of SiC and GaN devices, it is possible to realize more efficient power systems. Devices manufactured from SiC and GaN have already been impacting different areas with their ability to outperform Si devices. Some of the examples are the telecommunications, automotive/locomotive, power, and renewable energy industries. To achieve the carbon emission targets set by different countries, it is inevitable to use these new technologies. This book attempts to cover all the important facets related to wide bandgap semiconductor technology, including new challenges posed by it. This book is intended for graduate students, researchers, engineers, and technology experts who have been working in the exciting fields of SiC and GaN power devices.

Wafer Level Chip Scale Packaging

Wafer Level Chip Scale Packaging Book
Author : Shichun Qu,Yong Liu
Publisher : Springer
Release : 2014-09-10
ISBN : 1493915568
Language : En, Es, Fr & De

GET BOOK

Book Description :

Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology and power device integration. The book covers in detail how advances in semiconductor content, analog and power advanced WLCSP design, assembly, materials and reliability have co-enabled significant advances in fan-in and fan-out with redistributed layer (RDL) of analog and power device capability during recent years. Since the analog and power electronic wafer level packaging is different from regular digital and memory IC package, this book will systematically introduce the typical analog and power electronic wafer level packaging design, assembly process, materials, reliability and failure analysis, and material selection. Along with new analog and power WLCSP development, the role of modeling is a key to assure successful package design. An overview of the analog and power WLCSP modeling and typical thermal, electrical and stress modeling methodologies is also presented in the book.

Thermal and Electro thermal System Simulation 2020

Thermal and Electro thermal System Simulation 2020 Book
Author : Márta Rencz,Lorenzo Codecasa,Andras Poppe
Publisher : MDPI
Release : 2021-01-12
ISBN : 303943831X
Language : En, Es, Fr & De

GET BOOK

Book Description :

This book, edited by Prof. Marta Rencz and Prof Andras Poppe, Budapest University of Technology and Economics, and by Prof. Lorenzo Codecasa, Politecnico di Milano, collects fourteen papers carefully selected for the “thermal and electro-thermal system simulation” Special Issue of Energies. These contributions present the latest results in a currently very “hot” topic in electronics: the thermal and electro-thermal simulation of electronic components and systems. Several papers here proposed have turned out to be extended versions of papers presented at THERMINIC 2019, which was one of the 2019 stages of choice for presenting outstanding contributions on thermal and electro-thermal simulation of electronic systems. The papers proposed to the thermal community in this book deal with modeling and simulation of state-of-the-art applications which are highly critical from the thermal point of view, and around which there is great research activity in both industry and academia. In particular, contributions are proposed on the multi-physics simulation of families of electronic packages, multi-physics advanced modeling in power electronics, multiphysics modeling and simulation of LEDs, batteries and other micro and nano-structures.

Semiconductor Power Devices

Semiconductor Power Devices Book
Author : Josef Lutz,Heinrich Schlangenotto,Uwe Scheuermann,Rik De Doncker
Publisher : Springer
Release : 2018-02-16
ISBN : 3319709178
Language : En, Es, Fr & De

GET BOOK

Book Description :

Halbleiter-Leistungsbauelemente sind das Kernstück der Leistungselektronik. Sie bestimmen die Leistungsfähigkeit und machen neuartige und verlustarme Schaltungen erst möglich. In dem Band wird neben den Halbleiter-Leistungsbauelementen selbst auch die Aufbau- und Verbindungstechnik behandelt: von den physikalischen Grundlagen und der Herstellungstechnologie über einzelne Bauelemente bis zu thermomechanischen Problemen, Zerstörungsmechanismen und Störungseffekten. Die 2., überarbeitete Auflage berücksichtigt technische Neuerungen und Entwicklungen.

Electronic Enclosures Housings and Packages

Electronic Enclosures  Housings and Packages Book
Author : Frank Suli
Publisher : Woodhead Publishing
Release : 2018-11-15
ISBN : 008102391X
Language : En, Es, Fr & De

GET BOOK

Book Description :

Electronic Enclosures, Housings and Packages considers the problem of heat management for electronics from an encasement perspective. It addresses enclosures and their applications for industrial electronics, as well as LED lighting solutions for stationary and mobile markets. The book introduces fundamental concepts and defines dimensions of success in electrical enclosures. Other chapters discuss environmental considerations, shielding, standardization, materials selection, thermal management, product design principles, manufacturing techniques and sustainability. Final chapters focus on business fundamentals by outlining successful technical propositions and potential future directions. Introduces the concepts of materials recycling and sustainability to electronic enclosures Provides thorough coverage of all technical aspects relating to the design and manufacturing of electronic packaging Includes practical information on environmental considerations, shielding, standardization, materials selection, and more

Wide Bandgap Semiconductors for Power Electronics

Wide Bandgap Semiconductors for Power Electronics Book
Author : Peter Wellmann,Noboru Ohtani,Roland Rupp
Publisher : John Wiley & Sons
Release : 2021-09-28
ISBN : 3527824715
Language : En, Es, Fr & De

GET BOOK

Book Description :

Wide Bandgap Semiconductors for Power Electronic A guide to the field of wide bandgap semiconductor technology Wide Bandgap Semiconductors for Power Electronics is a comprehensive and authoritative guide to wide bandgap materials silicon carbide, gallium nitride, diamond and gallium(III) oxide. With contributions from an international panel of experts, the book offers detailed coverage of the growth of these materials, their characterization, and how they are used in a variety of power electronics devices such as transistors and diodes and in the areas of quantum information and hybrid electric vehicles. The book is filled with the most recent developments in the burgeoning field of wide bandgap semiconductor technology and includes information from cutting-edge semiconductor companies as well as material from leading universities and research institutions. By taking both scholarly and industrial perspectives, the book is designed to be a useful resource for scientists, academics, and corporate researchers and developers. This important book: Presents a review of wide bandgap materials and recent developments Links the high potential of wide bandgap semiconductors with the technological implementation capabilities Offers a unique combination of academic and industrial perspectives Meets the demand for a resource that addresses wide bandgap materials in a comprehensive manner Written for materials scientists, semiconductor physicists, electrical engineers, Wide Bandgap Semiconductors for Power Electronics provides a state of the art guide to the technology and application of SiC and related wide bandgap materials.

2018 IEEE 30th International Symposium on Power Semiconductor Devices and ICs ISPSD

2018 IEEE 30th International Symposium on Power Semiconductor Devices and ICs  ISPSD  Book
Author : IEEE Staff
Publisher : Unknown
Release : 2018-05-13
ISBN : 9781538668269
Language : En, Es, Fr & De

GET BOOK

Book Description :

ISPSD is the premier annual IEEE conference in the area of power semiconductor devices and ICs The conference covers a wide range of technical topics including wide bandgap semiconductor materials and devices, silicon power devices, power ICs, device physics and modeling, device packaging, and power electronics applications

Die Attach Materials for High Temperature Applications in Microelectronics Packaging

Die Attach Materials for High Temperature Applications in Microelectronics Packaging Book
Author : Kim S. Siow
Publisher : Springer
Release : 2019-01-29
ISBN : 3319992562
Language : En, Es, Fr & De

GET BOOK

Book Description :

This book presents the scientific principles, processing conditions, probable failure mechanisms, and a description of reliability performance and equipment required for implementing high-temperature and lead-free die attach materials. In particular, it addresses the use of solder alloys, silver and copper sintering, and transient liquid-phase sintering. While different solder alloys have been used widely in the microelectronics industry, the implementation of sintering silver and transient liquid-phase sintering remains limited to a handful of companies. Hence, the book devotes many chapters to sintering technologies, while simultaneously providing only a cursory coverage of the more widespread techniques employing solder alloys. Addresses the differences between sintering and soldering (the current die-attach technologies), thereby comprehensively addressing principles, methods, and performance of these high-temperature die-attach materials; Emphasizes the industrial perspective, with chapters written by engineers who have hands-on experience using these technologies; Baker Hughes, Bosch and ON Semiconductor, are represented as well as materials suppliers such as Indium; Simultaneously provides the detailed science underlying these technologies by leading academic researchers in the field.

Technology Report Current Developments in 3D Power Packaging with Focus on Embedded Substrate Technologies 2015

Technology Report   Current Developments in 3D Power Packaging with Focus on Embedded Substrate Technologies  2015  Book
Author : Anonim
Publisher : Unknown
Release : 2015-03-10
ISBN : 9780991564460
Language : En, Es, Fr & De

GET BOOK

Book Description :

This report is the Phase 2 report on 3D packaging of power sources and is a follow up to the previous report published by the PSMA Packaging Committee. The report begins with a discussion of PCB embedding technologies which are now in high volume production and together with 3D packaging technology predominately provide a significant performance and size reduction enhancement opportunity rather than a means to reduce costs. Also presented is information on high temperature die and component attachment technologies that are evolving rapidly in the research labs. However, high power-density component embedding and 3D packaging of power semiconductors also have to overcome a 'thermal barrier" - since it is more challenging to remove heat generated within the body of a 3D integrated system than from a planar surface. To execute an embedded power design is very dependent on the availability of passive components optimized for PCB embedding and the report includes some of the available sources. The report also includes the results of a worldwide literature search of R&D published by participating organizations. These technologies, combined with wide-bandgap semiconductor devices will literally re-vitalize the entire power electronics infrastructure block by block, module by module, for the twenty-first century.

Practical Guide to Digital Manufacturing

Practical Guide to Digital Manufacturing Book
Author : Zhuming Bi
Publisher : Springer Nature
Release : 2021-12-06
ISBN : 3030703045
Language : En, Es, Fr & De

GET BOOK

Book Description :

This book covers the subject of digital manufacturing. It provides a practical guide for readers on using computer aided design (CAD), computer aided engineering (CAE) and computer aided manufacturing (CAM) and other computer assistive tools for the design of products, machines, processes and system integrations through the case studies of engineering projects. The book introduces a thorough theoretical foundation and discussion of the historical development, and enabling technologies of digital manufacturing. It also covers a broad range of computer aided tools for a variety of applications including: geometric modelling; assembly modelling; motion simulation; finite element analysis; manufacturing process simulation; machining programming; product data management; and, product lifecycle management. Practical Guide to Digital Manufacturing uses many real-world case studies to illustrate the discussed applications, making it easily readable for undergraduate and graduate students, as well as engineers with the needs of computer-aided design and manufacturing knowledge and skills.

Energy and Water Development Appropriations for 2012 Dept of Energy FY 2012 justifications

Energy and Water Development Appropriations for 2012  Dept  of Energy FY 2012 justifications Book
Author : United States. Congress. House. Committee on Appropriations. Subcommittee on Energy and Water Development
Publisher : Unknown
Release : 2011
ISBN : 0987650XXX
Language : En, Es, Fr & De

GET BOOK

Book Description :

Download Energy and Water Development Appropriations for 2012 Dept of Energy FY 2012 justifications book written by United States. Congress. House. Committee on Appropriations. Subcommittee on Energy and Water Development, available in PDF, EPUB, and Kindle, or read full book online anywhere and anytime. Compatible with any devices.

Wide Bandgap Based Devices

Wide Bandgap Based Devices Book
Author : Farid Medjdoub
Publisher : MDPI
Release : 2021-05-26
ISBN : 3036505660
Language : En, Es, Fr & De

GET BOOK

Book Description :

Emerging wide bandgap (WBG) semiconductors hold the potential to advance the global industry in the same way that, more than 50 years ago, the invention of the silicon (Si) chip enabled the modern computer era. SiC- and GaN-based devices are starting to become more commercially available. Smaller, faster, and more efficient than their counterpart Si-based components, these WBG devices also offer greater expected reliability in tougher operating conditions. Furthermore, in this frame, a new class of microelectronic-grade semiconducting materials that have an even larger bandgap than the previously established wide bandgap semiconductors, such as GaN and SiC, have been created, and are thus referred to as “ultra-wide bandgap” materials. These materials, which include AlGaN, AlN, diamond, Ga2O3, and BN, offer theoretically superior properties, including a higher critical breakdown field, higher temperature operation, and potentially higher radiation tolerance. These attributes, in turn, make it possible to use revolutionary new devices for extreme environments, such as high-efficiency power transistors, because of the improved Baliga figure of merit, ultra-high voltage pulsed power switches, high-efficiency UV-LEDs, and electronics. This Special Issue aims to collect high quality research papers, short communications, and review articles that focus on wide bandgap device design, fabrication, and advanced characterization. The Special Issue will also publish selected papers from the 43rd Workshop on Compound Semiconductor Devices and Integrated Circuits, held in France (WOCSDICE 2019), which brings together scientists and engineers working in the area of III–V, and other compound semiconductor devices and integrated circuits. In particular, the following topics are addressed: – GaN- and SiC-based devices for power and optoelectronic applications – Ga2O3 substrate development, and Ga2O3 thin film growth, doping, and devices – AlN-based emerging material and devices – BN epitaxial growth, characterization, and devices

Energy and Water Development Appropriations for 2016

Energy and Water Development Appropriations for 2016 Book
Author : United States. Congress. House. Committee on Appropriations. Subcommittee on Energy and Water Development
Publisher : Unknown
Release : 2015
ISBN : 0987650XXX
Language : En, Es, Fr & De

GET BOOK

Book Description :

Download Energy and Water Development Appropriations for 2016 book written by United States. Congress. House. Committee on Appropriations. Subcommittee on Energy and Water Development, available in PDF, EPUB, and Kindle, or read full book online anywhere and anytime. Compatible with any devices.

Introduction to Microsystem Packaging Technology

Introduction to Microsystem Packaging Technology Book
Author : Yufeng Jin,Zhiping Wang,Jing Chen
Publisher : CRC Press
Release : 2017-12-19
ISBN : 1439865973
Language : En, Es, Fr & De

GET BOOK

Book Description :

The multi-billion-dollar microsystem packaging business continues to play an increasingly important technical role in today’s information industry. The packaging process—including design and manufacturing technologies—is the technical foundation upon which function chips are updated for use in application systems, and it is an important guarantee of the continued growth of technical content and value of information systems. Introduction to Microsystem Packaging Technology details the latest advances in this vital area, which involves microelectronics, optoelectronics, RF and wireless, MEMS, and related packaging and assembling technologies. It is purposefully written so that each chapter is relatively independent and the book systematically presents the widest possible overview of packaging knowledge. Elucidates the evolving world of packaging technologies for manufacturing The authors begin by introducing the fundamentals, history, and technical challenges of microsystems. Addressing an array of design techniques for packaging and integration, they cover substrate and interconnection technologies, examples of device- and system-level packaging, and various MEMS packaging techniques. The book also discusses module assembly and optoelectronic packaging, reliability methodologies and analysis, and prospects for the evolution and future applications of microsystems packaging and associated environmental protection. With its research examples and targeted reference questions and answers to reinforce understanding, this text is ideal for researchers, engineers, and students involved in microelectronics and MEMS. It is also useful to those who are not directly engaged in packaging but require a solid understanding of the field and its associated technologies.

High Temperature Packaging for Wide Bandgap Semiconductor Devices

High Temperature Packaging for Wide Bandgap Semiconductor Devices Book
Author : Brian J. Grummel
Publisher : Unknown
Release : 2008
ISBN : 0987650XXX
Language : En, Es, Fr & De

GET BOOK

Book Description :

Currently, wide bandgap semiconductor devices feature increased efficiency, higher current handling capabilities, and higher reverse blocking voltages than silicon devices while recent fabrication advances have them drawing near to the marketplace. However these new semiconductors are in need of new packaging that will allow for their application in several important uses including hybrid electrical vehicles, new and existing energy sources, and increased efficiency in multiple new and existing technologies. Also, current power module designs for silicon devices are rife with problems that must be enhanced to improve reliability. This thesis introduces new packaging that is thermally resilient and has reduced mechanical stress from temperature rise that also provides increased circuit lifetime and greater reliability for continued use to 300°C which is within operation ratings of these new semiconductors. The new module is also without problematic wirebonds that lead to a majority of traditional module failures which also introduce parasitic inductance and increase thermal resistance. Resultantly, the module also features a severely reduced form factor in mass and volume.