Skip to main content

Sputtering Materials For Vlsi And Thin Film Devices

In Order to Read Online or Download Sputtering Materials For Vlsi And Thin Film Devices Full eBooks in PDF, EPUB, Tuebl and Mobi you need to create a Free account. Get any books you like and read everywhere you want. Fast Download Speed ~ Commercial & Ad Free. We cannot guarantee that every book is in the library!

Sputtering Materials for VLSI and Thin Film Devices

Sputtering Materials for VLSI and Thin Film Devices Book
Author : Jaydeep Sarkar
Publisher : William Andrew
Release : 2010-12-13
ISBN : 0815519877
Language : En, Es, Fr & De

GET BOOK

Book Description :

An important resource for students, engineers and researchers working in the area of thin film deposition using physical vapor deposition (e.g. sputtering) for semiconductor, liquid crystal displays, high density recording media and photovoltaic device (e.g. thin film solar cell) manufacturing. This book also reviews microelectronics industry topics such as history of inventions and technology trends, recent developments in sputtering technologies, manufacturing steps that require sputtering of thin films, the properties of thin films and the role of sputtering target performance on overall productivity of various processes. Two unique chapters of this book deal with productivity and troubleshooting issues. The content of the book has been divided into two sections: (a) the first section (Chapter 1 to Chapter 3) has been prepared for the readers from a range of disciplines (e.g. electrical, chemical, chemistry, physics) trying to get an insight into use of sputtered films in various devices (e.g. semiconductor, display, photovoltaic, data storage), basic of sputtering and performance of sputtering target in relation to productivity, and (b) the second section (Chapter 4 to Chapter 8) has been prepared for readers who already have background knowledge of sputter deposition of thin films, materials science principles and interested in the details of sputtering target manufacturing methods, sputtering behavior and thin film properties specific to semiconductor, liquid crystal display, photovoltaic and magnetic data storage applications. In Chapters 5 to 8, a general structure has been used, i.e. a description of the applications of sputtered thin films, sputtering target manufacturing methods (including flow charts), sputtering behavior of targets (e.g. current - voltage relationship, deposition rate) and thin film properties (e.g. microstructure, stresses, electrical properties, in-film particles). While discussing these topics, attempts have been made to include examples from the actual commercial processes to highlight the increased complexity of the commercial processes with the growth of advanced technologies. In addition to personnel working in industry setting, university researchers with advanced knowledge of sputtering would also find discussion of such topics (e.g. attributes of target design, chamber design, target microstructure, sputter surface characteristics, various troubleshooting issues) useful. . Unique coverage of sputtering target manufacturing methods in the light of semiconductor, displays, data storage and photovoltaic industry requirements Practical information on technology trends, role of sputtering and major OEMs Discussion on properties of a wide variety of thin films which include silicides, conductors, diffusion barriers, transparent conducting oxides, magnetic films etc. Practical case-studies on target performance and troubleshooting Essential technological information for students, engineers and scientists working in the semiconductor, display, data storage and photovoltaic industry

The Foundations of Vacuum Coating Technology

The Foundations of Vacuum Coating Technology Book
Author : Donald M. Mattox
Publisher : William Andrew
Release : 2018-08-21
ISBN : 0128130857
Language : En, Es, Fr & De

GET BOOK

Book Description :

The Foundations of Vacuum Coating Technology, Second Edition, is a revised and expanded version of the first edition, which was published in 2003. The book reviews the histories of the various vacuum coating technologies and expands on the history of the enabling technologies of vacuum technology, plasma technology, power supplies, and low-pressure plasma-enhanced chemical vapor deposition. The melding of these technologies has resulted in new processes and products that have greatly expanded the application of vacuum coatings for use in our everyday lives. The book is unique in that it makes extensive reference to the patent literature (mostly US) and how it relates to the history of vacuum coating. The book includes a Historical Timeline of Vacuum Coating Technology and a Historical Timeline of Vacuum/Plasma Technology, as well as a Glossary of Terms used in the vacuum coating and surface engineering industries. History and detailed descriptions of Vacuum Deposition Technologies Review of Enabling Technologies and their importance to current applications Extensively referenced text Patents are referenced as part of the history Historical Timelines for Vacuum Coating Technology and Vacuum/Plasma Technology Glossary of Terms for vacuum coating

Advances In Smart Coatings And Thin Films For Future Industrial and Biomedical Engineering Applications

Advances In Smart Coatings And Thin Films For Future Industrial and Biomedical Engineering Applications Book
Author : Abdel Salam Hamdy Makhlouf,Nedal Yusuf Abu-Thabit
Publisher : Elsevier
Release : 2019-10-25
ISBN : 0128118938
Language : En, Es, Fr & De

GET BOOK

Book Description :

Advances In Smart Coatings And Thin Films For Future Industrial and Biomedical Engineering Applications discusses in detail, the recent trends in designing, fabricating and manufacturing of smart coatings and thin films for future high-tech. industrial applications related to transportation, aerospace and biomedical engineering. Chapters cover fundamental aspects and diverse approaches used to fabricate smart self-healing anti-corrosion coatings, shape-memory coatings, polymeric and nano-bio-ceramic cotings, bio-inspired and stimuli-responsive coatings for smart surfaces with antibacterial activkity and controlled wettability, and electrically conductive coatings and their emerging applications. With the emphasis on advanced methodologies and recent emerging applications of smart multifunctional coatings and thin films, this book is essential reading for materials scientists and rsearchers working in chemical sciences, advanced materials, sensors, pharmaceutical and biomedical engineering. Discusses the most recent advances and innovations in smart multifunctional coatings and thin films in the transportation, aerospace and biomedical engineering industries Highlights the synthesis methods, processing, testing and characterization of smart coatings and thin films Reviews the current prospects and future trends within the industry

Ceramic Thick Films for MEMS and Microdevices

Ceramic Thick Films for MEMS and Microdevices Book
Author : Robert A. Dorey
Publisher : William Andrew
Release : 2011
ISBN : 1437778178
Language : En, Es, Fr & De

GET BOOK

Book Description :

The MEMS (Micro Electro-Mechanical Systems) market returned to growth in 2010. The total MEMS market is worth about $6.5 billion, up more than 11 percent from last year and nearly as high as its historic peak in 2007. MEMS devices are used across sectors as diverse as automotive, aerospace, medical, industrial process control, instrumentation and telecommunications - forming the nerve center of products including airbag crash sensors, pressure sensors, biosensors and ink jet printer heads. Part of the MEMS cluster within the Micro & Nano Technologies Series, this book covers the fabrication techniques and applications of thick film piezoelectric micro electromechanical systems (MEMS). It includes examples of applications where the piezoelectric thick films have been used, illustrating how the fabrication process relates to the properties and performance of the resulting device. Other topics include: top-down and bottom-up fabrication of thick film MEMS, integration of thick films with other materials, effect of microstructure on properties, device performance, etc. Provides detailed guidance on the fabrication techniques and applications of thick film MEMS, for engineers and R&D groups. Written by a single author, this book provides a clear, coherently-written guide to this important emerging technology. Covers materials, fabrication and applications in one book.

High Mobility Materials for CMOS Applications

High Mobility Materials for CMOS Applications Book
Author : Nadine Collaert
Publisher : Woodhead Publishing
Release : 2018-06-29
ISBN : 0081020627
Language : En, Es, Fr & De

GET BOOK

Book Description :

High Mobility Materials for CMOS Applications provides a comprehensive overview of recent developments in the field of (Si)Ge and III-V materials and their integration on Si. The book covers material growth and integration on Si, going all the way from device to circuit design. While the book's focus is on digital applications, a number of chapters also address the use of III-V for RF and analog applications, and in optoelectronics. With CMOS technology moving to the 10nm node and beyond, however, severe concerns with power dissipation and performance are arising, hence the need for this timely work on the advantages and challenges of the technology. Addresses each of the challenges of utilizing high mobility materials for CMOS applications, presenting possible solutions and the latest innovations Covers the latest advances in research on heterogeneous integration, gate stack, device design and scalability Provides a broad overview of the topic, from materials integration to circuits

Thin Film Device Applications

Thin Film Device Applications Book
Author : Kasturi Chopra
Publisher : Springer Science & Business Media
Release : 2012-12-06
ISBN : 1461336821
Language : En, Es, Fr & De

GET BOOK

Book Description :

Two-dimensional materials created ab initio by the process of condensation of atoms, molecules, or ions, called thin films, have unique properties significantly different from the corresponding bulk materials as a result of their physical dimensions, geometry, nonequilibrium microstructure, and metallurgy. Further, these characteristic features of thin films can be drasti cally modified and tailored to obtain the desired and required physical characteristics. These features form the basis of development of a host of extraordinary active and passive thin film device applications in the last two decades. On the one extreme, these applications are in the submicron dimensions in such areas as very large scale integration (VLSI), Josephson junction quantum interference devices, magnetic bubbles, and integrated optics. On the other extreme, large-area thin films are being used as selective coatings for solar thermal conversion, solar cells for photovoltaic conver sion, and protection and passivating layers. Indeed, one would be hard pressed to find many sophisticated modern optical and electronic devices which do not use thin films in one way or the other. With the impetus provided by industrial applications, the science and technology of thin films have undergone revolutionary development and even today continue to be recognized globally as frontier areas of RID work. Major technical developments in any field of science and technology are invariably accompanied by an explosion of published literature in the form of scientific publications, reviews, and books.

TMS 2016 Supplemental Proceedings

TMS 2016 Supplemental Proceedings Book
Author : The Minerals, Metals & Materials Society (TMS)
Publisher : John Wiley & Sons
Release : 2016-02-09
ISBN : 1119274885
Language : En, Es, Fr & De

GET BOOK

Book Description :

The TMS 2016 Annual Meeting Supplemental Proceedings is a collection of papers from the TMS 2016 Annual Meeting & Exhibition, held February 14-18 in Nashville, Tennessee, USA. The papers in this volume represent 21 symposia from the meeting. This volume, along with the other proceedings volumes published for the meeting, and archival journals, such as Metallurgical and Materials Transactions and Journal of Electronic Materials, represents the available written record of the 67 symposia held at TMS2016. This proceedings volume contains both edited and unedited papers; the unedited papers have not necessarily been reviewed by the symposium organizers and are presented “as is.” The opinions and statements expressed within the papers are those of the individual authors only, and no confirmations or endorsements are intended or implied.

Nano optoelectronic Sensors and Devices

Nano optoelectronic Sensors and Devices Book
Author : Ning Xi,King Wai Chiu Lai
Publisher : William Andrew
Release : 2012
ISBN : 1437734715
Language : En, Es, Fr & De

GET BOOK

Book Description :

Nanophotonics has emerged as a major technology and applications domain, exploiting the interaction of light-emitting and light-sensing nanostructured materials. These devices are light-weight, highly efficient, low on power consumption, and are cost effective to produce. The authors of this book have been involved in pioneering work in manufacturing photonic devices from carbon nanotube (CNT) nanowires and provide a series of practical guidelines for their design and manufacture, using processes such as nano-robotic manipulation and assembly methods. They also introduce the design and operational principles of opto-elctrical sensing devices at the nano scale. Thermal annealing and packaging processes are also covered, as key elements in a scalable manufacturing process. Examples of applications of different nanowire based photonic devices are presented. These include applications in the fields of electronics (e.g. FET, CNT Schotty diode) and solar energy. The book provides graduate students, practitioners and professionals with the background knowledge and tools needed to research and concretely develop new devices in the area of nano photonics and the necessary nano-manipulation and nano-assembly technologies required to do so. Discusses opto-electronic nanomaterials, characterization and properties from an engineering perspective, enabling the commercialization of key emerging technologies Provides scalable techniques for nanowire structure growth, manipulation and assembly (i.e. synthesis) Explores key application areas such as sensing, electronics and solar energy.

Emerging Nanotechnologies in Dentistry

Emerging Nanotechnologies in Dentistry Book
Author : Karthikeyan Subramani,Waqar Ahmed
Publisher : William Andrew
Release : 2011-11-15
ISBN : 1455778575
Language : En, Es, Fr & De

GET BOOK

Book Description :

New nanomaterials are leading to a range of emerging dental treatments that utilize more biomimetic materials that more closely duplicate natural tooth structure (or bone, in the case of implants). The use of nanostructures that will work in harmony with the body’s own regenerative processes (eg, to restore tooth structure or alveolar bone) are moving into clinical practice. This book brings together an international team of experts from the fields of nanomaterials, biomedical engineering and dentistry, to cover the new materials and techniques with potential for use intra-orally or extra-orally for the restoration, fixation, replacement, or regeneration of hard and soft tissues in and about the oral cavity and craniofacial region. New dental nanotechnologies include the use of advanced inorganic and organic materials, smart and biomimetic materials, tissue engineering and drug delivery strategies. Book prepared by an interdisciplinary and international group of bio-nanomaterial scientists and dental/oral biomedical researchers Comprehensive professional reference for the subject covering materials fabrication and use of materials for all major diagnostic and therapeutic dental applications – repair,restoration, regeneration, implants and prevention Book focuses in depth on the materials manufacturing processes involved with emphasis on pre-clinical and clinical applications, use and biocompatibility

Micromixers

Micromixers Book
Author : Nam-Trung Nguyen
Publisher : William Andrew
Release : 2011-09-17
ISBN : 1437735215
Language : En, Es, Fr & De

GET BOOK

Book Description :

The ability to mix minute quantities of fluids is critical in a range of recent and emerging techniques in engineering, chemistry and life sciences, with applications as diverse as inkjet printing, pharmaceutical manufacturing, specialty and hazardous chemical manufacturing, DNA analysis and disease diagnosis. The multidisciplinary nature of this field – intersecting engineering, physics, chemistry, biology, microtechnology and biotechnology – means that the community of engineers and scientists now engaged in developing microfluidic devices has entered the field from a variety of different backgrounds. Micromixers is uniquely comprehensive, in that it deals not only with the problems that are directly related to fluidics as a discipline (aspects such as mass transport, molecular diffusion, electrokinetic phenomena, flow instabilities, etc.) but also with the practical issues of fabricating micomixers and building them into microsystems and lab-on-chip assemblies.With practical applications to the design of systems vital in modern communications, medicine and industry this book has already established itself as a key reference in an emerging and important field. The 2e includes coverage of a broader range of fabrication techniques, additional examples of fully realized devices for each type of micromixer and a substantially extended section on industrial applications, including recent and emerging applications. Introduces the design and applications of micromixers for a broad audience across chemical engineering, electronics and the life sciences, and applications as diverse as lab-on-a-chip, ink jet printing, pharmaceutical manufacturing and DNA analysis Helps engineers and scientists to unlock the potential of micromixers by explaining both the scientific (microfluidics) aspects and the engineering involved in building and using successful microscale systems and devices with micromixers The author's applied approach combines experience-based discussion of the challenges and pitfalls of using micromixers, with proposals for how to overcome them

CMOS Past Present and Future

CMOS Past  Present and Future Book
Author : Henry Radamson,Eddy Simoen,Jun Luo,Chao Zhao
Publisher : Woodhead Publishing
Release : 2018-04-03
ISBN : 0081021402
Language : En, Es, Fr & De

GET BOOK

Book Description :

CMOS Past, Present and Future provides insight from the basics, to the state-of-the-art of CMOS processing and electrical characterization, including the integration of Group IV semiconductors-based photonics. The book goes into the pitfalls and opportunities associated with the use of hetero-epitaxy on silicon with strain engineering and the integration of photonics and high-mobility channels on a silicon platform. It begins with the basic definitions and equations, but extends to present technologies and challenges, creating a roadmap on the origins of the technology and its evolution to the present, along with a vision for future trends. The book examines the challenges and opportunities that materials beyond silicon provide, including a close look at high-k materials and metal gate, strain engineering, channel material and mobility, and contacts. The book's key approach is on characterizations, device processing and electrical measurements. Addresses challenges and opportunities for the use of CMOS Covers the latest methods of strain engineering, materials integration to increase mobility, nano-scaled transistor processing, and integration of CMOS with photonic components Provides a look at the evolution of CMOS technology, including the origins of the technology, current status and future possibilities

Electronic Materials Handbook

Electronic Materials Handbook Book
Author : Anonim
Publisher : ASM International
Release : 1989-11-01
ISBN : 9780871702852
Language : En, Es, Fr & De

GET BOOK

Book Description :

Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.

Springer Handbook of Electronic and Photonic Materials

Springer Handbook of Electronic and Photonic Materials Book
Author : Safa Kasap,Peter Capper
Publisher : Springer
Release : 2017-10-04
ISBN : 331948933X
Language : En, Es, Fr & De

GET BOOK

Book Description :

The second, updated edition of this essential reference book provides a wealth of detail on a wide range of electronic and photonic materials, starting from fundamentals and building up to advanced topics and applications. Its extensive coverage, with clear illustrations and applications, carefully selected chapter sequencing and logical flow, makes it very different from other electronic materials handbooks. It has been written by professionals in the field and instructors who teach the subject at a university or in corporate laboratories. The Springer Handbook of Electronic and Photonic Materials, second edition, includes practical applications used as examples, details of experimental techniques, useful tables that summarize equations, and, most importantly, properties of various materials, as well as an extensive glossary. Along with significant updates to the content and the references, the second edition includes a number of new chapters such as those covering novel materials and selected applications. This handbook is a valuable resource for graduate students, researchers and practicing professionals working in the area of electronic, optoelectronic and photonic materials.

Handbook of Sputter Deposition Technology

Handbook of Sputter Deposition Technology Book
Author : Kiyotaka Wasa,Isaku Kanno,Hidetoshi Kotera
Publisher : William Andrew
Release : 2012
ISBN : 1437734839
Language : En, Es, Fr & De

GET BOOK

Book Description :

Sputtering is a Physical Vapor Deposition vacuum process used to deposit very thin films onto a substrate for a wide variety of commercial and scientific purposes. Sputtering occurs when an ionized gas molecule is used to displace atoms of a specific material. These atoms then bond at the atomic level to a substrate and create a thin film. Several types of sputtering processes exist, including: ion beam, diode, and magnetron sputtering. Cathode sputtering is widely used in the microelectronics industry for silicon integrated circuit production and for metallic coatings. High temperature, diamond films and ferroelectric materials are other applications. Sputtering applications are important across a wide range of industries, including the automotive, medical, semiconductors, space, plastics, and military sectors. A strong applications focus, covering current and emerging technologies, including nano-materials and MEMS (microelectrolmechanical systems) for energy, environments, communications, and/or bio-medical field. New chapters on computer simulation of sputtering and MEMS completes the update and insures that the new edition includes the most current and forward-looking coverage available. All applications discussed are supported by theoretical discussions, offering readers both the "how" and the "why" of each technique. 40% revision: the new edition includes an entirely new team of contributing authors with backgrounds specializing in the various new applications that are covered in the book and providing the most up-to-date coverage available anywhere.

Thin film materials technology

Thin film materials technology Book
Author : Kiyotaka Wasa,Makoto Kitabatake,Hideaki Adachi
Publisher : Springer Science & Business Media
Release : 2004-09-24
ISBN : 9783540211181
Language : En, Es, Fr & De

GET BOOK

Book Description :

This title contains rich historical coverage of the basics and new experimental and technological information about ceramic thin film and large-area functional coating. Included are principles and examples of making thin-film materials and devices.

VLSI Metallization

VLSI Metallization Book
Author : Norman G. Einspruch,Simon S. Cohen,Gennady Sh. Gildenblat
Publisher : Academic Press
Release : 2014-12-01
ISBN : 1483217817
Language : En, Es, Fr & De

GET BOOK

Book Description :

VLSI Electronics Microstructure Science, Volume 15: VLSI Metallization discusses the various issues and problems related to VLSI metallization. It details the available solutions and presents emerging trends. This volume is comprised of 10 chapters. The two introductory chapters, Chapter 1 and 2 serve as general references for the electrical and metallurgical properties of thin conducting films. Subsequent chapters review the various aspects of VLSI metallization. The order of presentation has been chosen to follow the common processing sequence. In Chapter 3, some relevant metal deposition techniques are discussed. Chapter 4 presents the methods of VLSI lithography and etching. Conducting films are first deposited at the gate definition step; therefore, the issues related to gate metallization are discussed next in Chapter 5.In Chapter 6, contact metallization is elaborated, and Chapter 7 is devoted to multilevel metallization schemes. Long-time reliability is the subject of Chapter 8, which discusses the issues of contact and interconnect electromigration. GaAs metallization is tackled in Chapter 9. The volume concludes with a general discussion of the functions of interconnect systems in VLSI. Materials scientists, processing and design engineers, and device physicists will find the book very useful.

Multicomponent and Multilayered Thin Films for Advanced Microtechnologies Techniques Fundamentals and Devices

Multicomponent and Multilayered Thin Films for Advanced Microtechnologies  Techniques  Fundamentals and Devices Book
Author : O. Auciello,Jürgen Engemann
Publisher : Springer Science & Business Media
Release : 2012-12-06
ISBN : 9401117276
Language : En, Es, Fr & De

GET BOOK

Book Description :

The synthesis of multicomponent/multilayered superconducting, conducting, semiconducting and insulating thin films has become the subject of an intensive, worldwide, interdisciplinary research effort. The development of deposition-characterization techniques and the science and technology related to the synthesis of these films are critical for the successful evolution of this interdisciplinary field of research and the implementation of the new materials in a whole new generation of advanced microdevices. This book contains the lectures and contributed papers on various scientific and technological aspects of multicomponent and multilayered thin films presented at a NATO/ASI. Compared to other recent books on thin films, the distinctive character of this book is the interdisciplinary treatment of the various fields of research related to the different thin film materials mentioned above. The wide range of topics discussed in this book include vacuum-deposition techniques, synthesis-processing, characterization, and devices of multicomponent/multilayered oxide high temperature superconducting, ferroelectric, electro-optic, optical, metallic, silicide, and compound semiconductor thin films. The book presents an unusual intedisciplinary exchange of ideas between researchers with cross-disciplinary backgrounds and it will be useful to established investigators as well as postdoctoral and graduate students.

Metallurgical Coatings and Thin Films 1990

Metallurgical Coatings and Thin Films 1990 Book
Author : B.D. Sartwell
Publisher : Elsevier
Release : 2012-12-02
ISBN : 0444601104
Language : En, Es, Fr & De

GET BOOK

Book Description :

Metallurgical Coatings and Thin Films 1990 presents the Proceedings of the 17th International Conference on Metallurgical Coatings and 8th International Conference on Thin Films, held in San Diego, California on April 2-6, 1990. It contains 219 papers covering a wide range of topics related to metallurgical coatings and thin films, including high temperature coatings, hard coatings, diamond films, tribology, and ion beam modification. Organized into 99 chapters, this volume begins with a discussion of a thermochemical model for diamond growth from the vapor phase and an experiment in large area diamond coating using a combustion flame torch in its traversing mode. It then explores the properties of diamond films, preparation of diamond-like carbon films using various ion-beam-assisted techniques, deposition of diamond-like films by laser ablation, and coating of cubic BN films on different substrates. The book examines surface processes and rate-determining steps in plasma-induced chemical vapor deposition, and addition of rare earths to improve scale adherence on heat-resisting alloys and coatings. The reader is introduced to high temperature wear and clearance control coatings, thermal barrier coatings, and corrosion resistant coatings. The book also discusses modification of coatings/surfaces to reduce friction; the mechanics of the tribology of thin films systems; mechanochemical interactions in the tribological behavior of materials; analysis and micromechanical testing of tribological coatings; surface modification using directed ion beams; and industrial equipment and processes. This book is a valuable resource for students and researchers interested in metallurgical coatings and thin films.

Thin Film Materials And Devices Developments In Science And Technology Proceedings Of The Tenth International School

Thin Film Materials And Devices  Developments In Science And Technology  Proceedings Of The Tenth International School Book
Author : J M Marshall,Nikolav Kirov,Alexander Vavrek,J M Maud
Publisher : World Scientific
Release : 1999-06-01
ISBN : 9814543705
Language : En, Es, Fr & De

GET BOOK

Book Description :

This volume constitutes the proceedings of the tenth meeting of the International school on Condensed Matter Physics. Since 1980, this community of condensed matter scientists has gathered in Varna, Bulgaria, every two years, to review and discuss the development of various investigations in the field, to present the latest results, and to outline the most important trends in condensed matter science.The book reflects the development of the field, and points to the growing interest in the application of theoretical achievements and to the mutual inspirations of science and technology.

Semiconductor Material and Device Characterization

Semiconductor Material and Device Characterization Book
Author : Dieter K. Schroder
Publisher : John Wiley & Sons
Release : 2006
ISBN : 0471739065
Language : En, Es, Fr & De

GET BOOK

Book Description :

Resistivity -- Carrier and doping density -- Contact resistance and Schottky barriers -- Series resistance, channel length and width, and threshold voltage -- Defects -- Oxide and interface trapped charges, oxide thickness -- Carrier lifetimes -- Mobility -- Charge-based and probe characterization -- Optical characterization -- Chemical and physical characterization -- Reliability and failure analysis.