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Reliability And Failure Of Electronic Materials And Devices

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Reliability and Failure of Electronic Materials and Devices

Reliability and Failure of Electronic Materials and Devices Book
Author : Milton Ohring,Lucian Kasprzak
Publisher : Academic Press
Release : 2014-11-03
ISBN : 0080575528
Language : En, Es, Fr & De

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Book Description :

Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices. Covers all major types of electronics materials degradation and their causes, including dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, and failure of contacts and solder joints New updated sections on "failure physics," on mass transport-induced failure in copper and low-k dielectrics, and on reliability of lead-free/reduced-lead solder connections New chapter on testing procedures, sample handling and sample selection, and experimental design Coverage of new packaging materials, including plastics and composites

Reliability and Failure of electronic Materials and Devices 2 E

Reliability and Failure of electronic Materials and Devices 2 E Book
Author : Milton Ohring
Publisher : Unknown
Release : 2015-04
ISBN : 0987650XXX
Language : En, Es, Fr & De

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Book Description :

Download Reliability and Failure of electronic Materials and Devices 2 E book written by Milton Ohring, available in PDF, EPUB, and Kindle, or read full book online anywhere and anytime. Compatible with any devices.

Corrosion and Reliability of Electronic Materials and Devices

Corrosion and Reliability of Electronic Materials and Devices Book
Author : Robert B. Comizzoli,Robert Peter Frankenthal,James Douglas Sinclair
Publisher : The Electrochemical Society
Release : 1999
ISBN : 9781566772525
Language : En, Es, Fr & De

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Book Description :

Download Corrosion and Reliability of Electronic Materials and Devices book written by Robert B. Comizzoli,Robert Peter Frankenthal,James Douglas Sinclair, available in PDF, EPUB, and Kindle, or read full book online anywhere and anytime. Compatible with any devices.

Yield of Electronic Materials and Devices

Yield of Electronic Materials and Devices Book
Author : National Research Council (U.S.). Ad Hoc Panel on Yield of Electronic Materials and Devices
Publisher : Unknown
Release : 1972
ISBN : 0987650XXX
Language : En, Es, Fr & De

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Book Description :

Download Yield of Electronic Materials and Devices book written by National Research Council (U.S.). Ad Hoc Panel on Yield of Electronic Materials and Devices, available in PDF, EPUB, and Kindle, or read full book online anywhere and anytime. Compatible with any devices.

Semiconductor Material and Device Characterization

Semiconductor Material and Device Characterization Book
Author : Dieter K. Schroder
Publisher : John Wiley & Sons
Release : 2006-02-10
ISBN : 0471749087
Language : En, Es, Fr & De

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Book Description :

This Third Edition updates a landmark text with thelatest findings The Third Edition of the internationally laudedSemiconductor Material and Device Characterization bringsthe text fully up-to-date with the latest developments in the fieldand includes new pedagogical tools to assist readers. Not only doesthe Third Edition set forth all the latest measurementtechniques, but it also examines new interpretations and newapplications of existing techniques. Semiconductor Material and Device Characterizationremains the sole text dedicated to characterization techniques formeasuring semiconductor materials and devices. Coverage includesthe full range of electrical and optical characterization methods,including the more specialized chemical and physical techniques.Readers familiar with the previous two editions will discover athoroughly revised and updated Third Edition, including: Updated and revised figures and examples reflecting the mostcurrent data and information 260 new references offering access to the latest research anddiscussions in specialized topics New problems and review questions at the end of each chapter totest readers' understanding of the material In addition, readers will find fully updated and revisedsections in each chapter. Plus, two new chapters have been added: Charge-Based and Probe Characterization introduces charge-basedmeasurement and Kelvin probes. This chapter also examinesprobe-based measurements, including scanning capacitance, scanningKelvin force, scanning spreading resistance, and ballistic electronemission microscopy. Reliability and Failure Analysis examines failure times anddistribution functions, and discusses electromigration, hotcarriers, gate oxide integrity, negative bias temperatureinstability, stress-induced leakage current, and electrostaticdischarge. Written by an internationally recognized authority in the field,Semiconductor Material and Device Characterization remainsessential reading for graduate students as well as forprofessionals working in the field of semiconductor devices andmaterials. An Instructor's Manual presenting detailed solutions to all theproblems in the book is available from the Wiley editorialdepartment.

Proceedings of the Third International Symposium on Corrosion and Reliability of Electronic Materials and Devices

Proceedings of the Third International Symposium on Corrosion and Reliability of Electronic Materials and Devices Book
Author : Robert B. Comizzoli,Robert Peter Frankenthal,James Douglas Sinclair
Publisher : The Electrochemical Society
Release : 1994
ISBN : 9781566770880
Language : En, Es, Fr & De

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Book Description :

Download Proceedings of the Third International Symposium on Corrosion and Reliability of Electronic Materials and Devices book written by Robert B. Comizzoli,Robert Peter Frankenthal,James Douglas Sinclair, available in PDF, EPUB, and Kindle, or read full book online anywhere and anytime. Compatible with any devices.

Materials Science of Thin Films

Materials Science of Thin Films Book
Author : Milton Ohring
Publisher : Academic Press
Release : 2002
ISBN : 0125249756
Language : En, Es, Fr & De

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Book Description :

This is the first book that can be considered a textbook on thin film science, complete with exercises at the end of each chapter. Ohring has contributed many highly regarded reference books to the AP list, including Reliability and Failure of Electronic Materials and the Engineering Science of Thin Films. The knowledge base is intended for science and engineering students in advanced undergraduate or first-year graduate level courses on thin films and scientists and engineers who are entering or require an overview of the field. Since 1992, when the book was first published, the field of thin films has expanded tremendously, especially with regard to technological applications. The second edition will bring the book up-to-date with regard to these advances. Most chapters have been greatly updated, and several new chapters have been added.

Degradation Reliability and Failure of Semiconductor Electronic Devices

Degradation  Reliability  and Failure of Semiconductor Electronic Devices Book
Author : Anonim
Publisher : Unknown
Release : 2006
ISBN : 0987650XXX
Language : En, Es, Fr & De

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Book Description :

We show how defects in semiconductor device structures are formed, how they can affect the properties and reliability of devices, and how they might be avoided. Examples will be drawn from wide band gap semiconductor materials and devices we have fabricated in-house or examined for DARPA, collaborators in the P & E CTA, a power electronics MTO, or an SBIR.

Coating Materials for Electronic Applications

Coating Materials for Electronic Applications Book
Author : James J. Licari
Publisher : William Andrew
Release : 2003-06-11
ISBN : 0815516479
Language : En, Es, Fr & De

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Book Description :

This first book in the Materials and Processes for Electronics Applications series answers questions vital to the successful design and manufacturing of electronic components, modules, and systems such as: - How can one protect electronic assemblies from prolonged high humidity, high temperatures, salt spray or other terrestrial and space environments? - What coating types can be used to protect microelectronics in military, space, automotive, or medical environments? - How can the chemistry of polymers be correlated to desirable physical and electrical properties? - How can a design engineer avoid subsequent potential failures due to corrosion, metal migration, electrical degradation, outgassing? - What are the best processes that manufacturing can use to mask, clean, prepare the surface, dispense the coating, and cure the coating? - What quality assurance and in-process tests can be used to assure reliability? - What government or industry specifications are available? - How can organic coatings be selected to meet OSHA, EPA, and other regulations? Besides a discussion of the traditional roles of coatings for moisture and environmental protection of printed circuit assemblies, this book covers dielectric coatings that provide electrical functions such as the low-dielectric-constant dielectrics used to fabricate multilayer interconnect substrates and high-frequency, high-speed circuits. Materials engineers and chemists will benefit greatly from a chapter on the chemistry and properties of the main types of polymer coatings including: Epoxies, Polyimides, Silicones, Polyurethanes, Parylene, Benzocyclobenzene and many others. For manufacturing personnel, there is an entire chapter of over a dozen processes for masking, cleaning, and surface preparation and a comprehensive review of over 20 processes for the application and curing of coatings including recent extrusion, meniscus, and curtain coating methods used in processing large panels. The pros and cons of each method are given to aid the engineer in selecting the optimum method for his/her application. As a bonus, from his own experience, the author discusses some caveats that will help reduce costs and avoid failures. Finally, the author discusses regulations of OSHA, EPA, and other government agencies which have resulted in formulation changes to meet VOC and toxicity requirements. Tables of numerous military, commercial, industry, and NASA specifications are given to help the engineer select the proper callout.

Failure Analysis

Failure Analysis Book
Author : Marius Bazu,Titu Bajenescu
Publisher : Wiley
Release : 2011-04-25
ISBN : 9780470748244
Language : En, Es, Fr & De

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Book Description :

Failure analysis is the preferred method to investigate product or process reliability and to ensure optimum performance of electrical components and systems. The physics-of-failure approach is the only internationally accepted solution for continuously improving the reliability of materials, devices and processes. The models have been developed from the physical and chemical phenomena that are responsible for degradation or failure of electronic components and materials and now replace popular distribution models for failure mechanisms such as Weibull or lognormal. Reliability engineers need practical orientation around the complex procedures involved in failure analysis. This guide acts as a tool for all advanced techniques, their benefits and vital aspects of their use in a reliability programme. Using twelve complex case studies, the authors explain why failure analysis should be used with electronic components, when implementation is appropriate and methods for its successful use. Inside you will find detailed coverage on: a synergistic approach to failure modes and mechanisms, along with reliability physics and the failure analysis of materials, emphasizing the vital importance of cooperation between a product development team involved the reasons why failure analysis is an important tool for improving yield and reliability by corrective actions the design stage, highlighting the ‘concurrent engineering' approach and DfR (Design for Reliability) failure analysis during fabrication, covering reliability monitoring, process monitors and package reliability reliability resting after fabrication, including reliability assessment at this stage and corrective actions a large variety of methods, such as electrical methods, thermal methods, optical methods, electron microscopy, mechanical methods, X-Ray methods, spectroscopic, acoustical, and laser methods new challenges in reliability testing, such as its use in microsystems and nanostructures This practical yet comprehensive reference is useful for manufacturers and engineers involved in the design, fabrication and testing of electronic components, devices, ICs and electronic systems, as well as for users of components in complex systems wanting to discover the roots of the reliability flaws for their products.

Engineering Materials Science

Engineering Materials Science Book
Author : Milton Ohring
Publisher : Elsevier
Release : 1995-11-29
ISBN : 9780080505695
Language : En, Es, Fr & De

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Book Description :

Milton Ohring's Engineering Materials Science integrates the scientific nature and modern applications of all classes of engineering materials. This comprehensive, introductory textbook will provide undergraduate engineering students with the fundamental background needed to understand the science of structure-property relationships, as well as address the engineering concerns of materials selection in design, processing materials into useful products, andhow material degrade and fail in service. Specific topics include: physical and electronic structure; thermodynamics and kinetics; processing; mechanical, electrical, magnetic, and optical properties; degradation; and failure and reliability. The book offers superior coverage of electrical, optical, and magnetic materials than competing text. The author has taught introductory courses in material science and engineering both in academia and industry (AT&T Bell Laboratories) and has also written the well-received book, The Material Science of Thin Films (Academic Press). Key Features * Provides a modern treatment of materials exposing the interrelated themes of structure, properties, processing, and performance * Includes an interactive, computationally oriented, computer disk containing nine modules dealing with structure, phase diagrams, diffusion, and mechanical and electronic properties * Fundamentals are stressed * Of particular interest to students, researchers, and professionals in the field of electronic engineering

Electronic Materials Handbook

Electronic Materials Handbook Book
Author : Anonim
Publisher : ASM International
Release : 1989-11-01
ISBN : 9780871702852
Language : En, Es, Fr & De

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Book Description :

Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.

Solutions Manual to Accompany Engineering Materials Science

Solutions Manual to Accompany Engineering Materials Science Book
Author : Milton Ohring
Publisher : Unknown
Release : 1995
ISBN : 9780125249980
Language : En, Es, Fr & De

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Book Description :

Solutions Manual to Accompany Engineering Materials Science provides information pertinent to the fundamental aspects of materials science. This book presents a compilation of solutions to a variety of problems or issues in engineering materials science. Organized into 15 chapters, this book begins with an overview of the approximate added value in a contact lens manufactured from a polymer. This text then examines several problems based on the electron energy levels for various elements. Other chapters explain why the lattice constants of materials can be determined with extraordinary precision by X-ray diffraction, but with constantly less precision and accuracy using electron diffraction techniques. This book discusses as well the formula for the condensation reaction between urea and formaldehyde to produce thermosetting urea-formaldehyde. The final chapter deals with the similarities between electrically and mechanically functional materials with regard to reliability issues. This book is a valuable resource for engineers, students, and research workers.

Defects in Microelectronic Materials and Devices

Defects in Microelectronic Materials and Devices Book
Author : Daniel M. Fleetwood,Ronald D. Schrimpf
Publisher : CRC Press
Release : 2008-11-19
ISBN : 9781420043778
Language : En, Es, Fr & De

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Book Description :

Uncover the Defects that Compromise Performance and Reliability As microelectronics features and devices become smaller and more complex, it is critical that engineers and technologists completely understand how components can be damaged during the increasingly complicated fabrication processes required to produce them. A comprehensive survey of defects that occur in silicon-based metal-oxide semiconductor field-effect transistor (MOSFET) technologies, this book also discusses flaws in linear bipolar technologies, silicon carbide-based devices, and gallium arsenide materials and devices. These defects can profoundly affect the yield, performance, long-term reliability, and radiation response of microelectronic devices and integrated circuits (ICs). Organizing the material to build understanding of the problems and provide a quick reference for scientists, engineers and technologists, this text reviews yield- and performance-limiting defects and impurities in the device silicon layer, in the gate insulator, and/or at the critical Si/SiO2 interface. It then examines defects that impact production yield and long-term reliability, including: Vacancies, interstitials, and impurities (especially hydrogen) Negative bias temperature instabilities Defects in ultrathin oxides (SiO2 and silicon oxynitride) Take A Proactive Approach The authors condense decades of experience and perspectives of noted experimentalists and theorists to characterize defect properties and their impact on microelectronic devices. They identify the defects, offering solutions to avoid them and methods to detect them. These include the use of 3-D imaging, as well as electrical, analytical, computational, spectroscopic, and state-of-the-art microscopic methods. This book is a valuable look at challenges to come from emerging materials, such as high-K gate dielectrics and high-mobility substrates being developed to replace Si02 as the preferred gate dielectric material, and high-mobility substrates.

Micro and Opto Electronic Materials and Structures Physics Mechanics Design Reliability Packaging

Micro  and Opto Electronic Materials and Structures  Physics  Mechanics  Design  Reliability  Packaging Book
Author : Ephraim Suhir,Y.C. Lee,C.P. Wong
Publisher : Springer Science & Business Media
Release : 2007-05-26
ISBN : 0387329897
Language : En, Es, Fr & De

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Book Description :

This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.

Failure Analysis

Failure Analysis Book
Author : Marius Bazu,Titu Bajenescu
Publisher : John Wiley & Sons
Release : 2011-03-08
ISBN : 9781119990000
Language : En, Es, Fr & De

GET BOOK

Book Description :

Failure analysis is the preferred method to investigate product or process reliability and to ensure optimum performance of electrical components and systems. The physics-of-failure approach is the only internationally accepted solution for continuously improving the reliability of materials, devices and processes. The models have been developed from the physical and chemical phenomena that are responsible for degradation or failure of electronic components and materials and now replace popular distribution models for failure mechanisms such as Weibull or lognormal. Reliability engineers need practical orientation around the complex procedures involved in failure analysis. This guide acts as a tool for all advanced techniques, their benefits and vital aspects of their use in a reliability programme. Using twelve complex case studies, the authors explain why failure analysis should be used with electronic components, when implementation is appropriate and methods for its successful use. Inside you will find detailed coverage on: a synergistic approach to failure modes and mechanisms, along with reliability physics and the failure analysis of materials, emphasizing the vital importance of cooperation between a product development team involved the reasons why failure analysis is an important tool for improving yield and reliability by corrective actions the design stage, highlighting the ‘concurrent engineering' approach and DfR (Design for Reliability) failure analysis during fabrication, covering reliability monitoring, process monitors and package reliability reliability resting after fabrication, including reliability assessment at this stage and corrective actions a large variety of methods, such as electrical methods, thermal methods, optical methods, electron microscopy, mechanical methods, X-Ray methods, spectroscopic, acoustical, and laser methods new challenges in reliability testing, such as its use in microsystems and nanostructures This practical yet comprehensive reference is useful for manufacturers and engineers involved in the design, fabrication and testing of electronic components, devices, ICs and electronic systems, as well as for users of components in complex systems wanting to discover the roots of the reliability flaws for their products.

Moisture Sensitivity of Plastic Packages of IC Devices

Moisture Sensitivity of Plastic Packages of IC Devices Book
Author : X.J. Fan,E. Suhir
Publisher : Springer Science & Business Media
Release : 2010-07-23
ISBN : 1441957197
Language : En, Es, Fr & De

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Book Description :

Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most updated, in-depth and systematic technical and theoretical approaches are addressed in the book. Numerous industrial applications are provided, along with the results of the most recent research and development efforts, including, but not limited to: thorough exploration of moisture's effects based on lectures and tutorials by the authors, consistent focus on solution-based approaches and methodologies for improved reliability in plastic packaging, emerging theories and cutting-edge industiral applications presented by the leading professionals in the field. Moisture plays a key role in the reliability of plastic packages of IC devices, and moisture-induced failures have become an increasing concern with the development of advanced IC devices. This second volume in the Micro- and Opto-Electronic Materials, Structures, and Systems series is a must-read for researchers and engineers alike.

Power Electronic Packaging

Power Electronic Packaging Book
Author : Yong Liu
Publisher : Springer
Release : 2014-04-13
ISBN : 9781489987976
Language : En, Es, Fr & De

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Book Description :

Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.

Nanoelectronic Materials Devices and Modeling

Nanoelectronic Materials  Devices and Modeling Book
Author : Qiliang Li,Hao Zhu
Publisher : MDPI
Release : 2019-07-15
ISBN : 3039212257
Language : En, Es, Fr & De

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Book Description :

As CMOS scaling is approaching the fundamental physical limits, a wide range of new nanoelectronic materials and devices have been proposed and explored to extend and/or replace the current electronic devices and circuits so as to maintain progress with respect to speed and integration density. The major limitations, including low carrier mobility, degraded subthreshold slope, and heat dissipation, have become more challenging to address as the size of silicon-based metal oxide semiconductor field effect transistors (MOSFETs) has decreased to nanometers, while device integration density has increased. This book aims to present technical approaches that address the need for new nanoelectronic materials and devices. The focus is on new concepts and knowledge in nanoscience and nanotechnology for applications in logic, memory, sensors, photonics, and renewable energy. This research on nanoelectronic materials and devices will be instructive in finding solutions to address the challenges of current electronics in switching speed, power consumption, and heat dissipation and will be of great interest to academic society and the industry.