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Reliability And Failure Analysis Of High Power Led Packaging

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Reliability and Failure Analysis of High Power LED Packaging

Reliability and Failure Analysis of High Power LED Packaging Book
Author : Cher Ming Tan,Preetpal Singh
Publisher : Woodhead Publishing
Release : 2021-08-15
ISBN : 9780128224083
Language : En, Es, Fr & De

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Book Description :

Reliability and Failure Analysis of High Power LED Packaging provides the fundamental understanding of the reliability and failure analysis materials interfaces for high power LEDs packaging with the ultimate goal of enabling new packaging materials. This book describes the limitations of the present reliability standards in determining the lifetime of high-power LEDs due to the lack of deep understanding of the packaging materials and their interaction with each other. Many new failure mechanisms are investigated and presented with consideration of the different stresses imposed by varying environmental conditions. The detailed failure mechanisms are unique to this book and will provide new insights for readers regarding the different possible failure mechanisms in high power LEDs. The authors also show the importance of simulation in understanding the hidden failure mechanisms in LEDs. Along with simulation, the use of various destructive and non-destructive tools such as C-SAM, SEM, FTIR, Optical Microscopy, etc. in investigation of the causes of LED failures are reviewed. The advancement of LEDs in the last two decades has opened vast new applications for LEDs which also has led to a harsher stress conditions that high-power LEDs have to face. Thus, existing standards and reliability tests need to be revised to meet the new demands for high-power LEDs. Introduces the failure mechanisms of high power LEDs under varying environmental conditions and methods of how to test, simulate and predict them Describes the chemistry underlying the material degradation and its impact on LEDs Discusses future directions of new packaging materials for improved performance and reliability of high power LEDs

Solid State Lighting Reliability

Solid State Lighting Reliability Book
Author : W.D. van Driel,X.J. Fan
Publisher : Springer Science & Business Media
Release : 2012-09-06
ISBN : 1461430674
Language : En, Es, Fr & De

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Book Description :

Solid State Lighting Reliability: Components to Systems begins with an explanation of the major benefits of solid state lighting (SSL) when compared to conventional lighting systems including but not limited to long useful lifetimes of 50,000 (or more) hours and high efficacy. When designing effective devices that take advantage of SSL capabilities the reliability of internal components (optics, drive electronics, controls, thermal design) take on critical importance. As such a detailed discussion of reliability from performance at the device level to sub components is included as well as the integrated systems of SSL modules, lamps and luminaires including various failure modes, reliability testing and reliability performance. A follow-up, Solid State Lighting Reliability Part 2, was published in 2017.

Advances in Electronic Engineering Communication and Management Vol 2

Advances in Electronic Engineering  Communication and Management Vol 2 Book
Author : David Jin,Sally Lin
Publisher : Springer Science & Business Media
Release : 2012-01-18
ISBN : 3642272967
Language : En, Es, Fr & De

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Book Description :

This volume presents the main results of 2011 International Conference on Electronic Engineering, Communication and Management (EECM2011) held December 24-25, 2011, Beijing China. The EECM2011 is an integrated conference providing a valuable opportunity for researchers, scholars and scientists to exchange their ideas face to face together. The main focus of the EECM 2011 and the present 2 volumes “Advances in Electronic Engineering, Communication and Management” is on Power Engineering, Electrical engineering applications, Electrical machines, as well as Communication and Information Systems Engineering. This volume presents the main results of 2011 International Conference on Electronic Engineering, Communication and Management (EECM2011) held December 24-25, 2011, Beijing China. The EECM2011 is an integrated conference providing a valuable opportunity for researchers, scholars and scientists to exchange their ideas face to face together. The main focus of the EECM 2011 and the present 2 volumes “Advances in Electronic Engineering, Communication and Management” is on Power Engineering, Electrical engineering applications, Electrical machines, as well as Communication and Information Systems Engineering.

LED Packaging for Lighting Applications

LED Packaging for Lighting Applications Book
Author : Sheng Liu,Xiaobing Luo
Publisher : John Wiley & Sons
Release : 2011-07-05
ISBN : 0470827831
Language : En, Es, Fr & De

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Book Description :

"This book provides quantitative methods for optical, thermal, reliability modelling and simulation so that predictive quantitative modelling can be achieved"--

International Conference on Energy and Power Engineering EPE2014

International Conference on Energy and Power Engineering  EPE2014  Book
Author : Anonim
Publisher : DEStech Publications, Inc
Release : 2014-06-24
ISBN : 1605951803
Language : En, Es, Fr & De

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Book Description :

The 2014 International Conference on Energy and Power Engineering (EPE2014), will be held on April 26–27, 2014, in Hong Kong, China. The aim of this international convention is to bring together experts and scholars from around the world and offer them a chance to share the latest research results in the field of Energy and Power Engineering. We all know that over the past few decades, a great change has happened in the field of the environment technology, and the science technology is growing faster and faster. In order to keep up with the daily changing situation, we have sent invitations to experts, scholars and other people who have devoted himself in related fields, and it is a great honor to us that most of them have accepted our invitation and supported the EPE2014 with their latest studies. Up till now, we have received over three hundred papers from various countries; this shows that there has been a growing interest in the field of energy and power engineering. Among those papers received, we have eventually chosen about a hundred to be presented and included in this proceeding. These papers generally represented the current research status in this field and the future trend. We sincerely believe that these papers could be valuable to the future work of yours. Finally, on behalf of the committee, I would like to deeply express our gratitude to those who have supported the EPE2014, especially the international experts who helped reviewing papers, the DEStech Publications help publish the conference proceedings, and last but not least, the authors of these inspiring papers. Without the help from these people, EPE2014 would not be as half successful as it is now. Here, welcome to EPE2014 and let’s hope that it will be a great success. Tim Chou

Nano Bio Electronic Photonic and MEMS Packaging

Nano Bio  Electronic  Photonic and MEMS Packaging Book
Author : C. P.(Ching-Ping) Wong,Kyoung-sik (Jack) Moon,Yi Li
Publisher : Springer Nature
Release : 2020-10-17
ISBN : 303049991X
Language : En, Es, Fr & De

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Book Description :

This book shows how nanofabrication techniques and nanomaterials can be used to customize packaging for nano devices with applications to electronics, photonics, biological and biomedical research and products. It covers topics such as bio sensing electronics, bio device packaging, MEMS for bio devices and much more, including: Offers a comprehensive overview of nano and bio packaging and their materials based on their chemical and physical sciences and mechanical, electrical and material engineering perspectives; Discusses nano materials as power energy sources, computational analyses of nano materials including molecular dynamic (MD) simulations and DFT calculations; Analyzes nanotubes, superhydrophobic self-clean Lotus surfaces; Covers nano chemistry for bio sensor/bio material device packaging. This second edition includes new chapters on soft materials-enabled packaging for stretchable and wearable electronics, state of the art miniaturization for active implantable medical devices, recent LED packaging and progress, nanomaterials for recent energy storage devices such as lithium ion batteries and supercapacitors and their packaging. Nano- Bio- Electronic, Photonic and MEMS Packaging is the ideal book for all biomedical engineers, industrial electronics packaging engineers, and those engaged in bio nanotechnology applications research.

Prognostics and Health Management of Electronics

Prognostics and Health Management of Electronics Book
Author : Michael G. Pecht,Myeongsu Kang
Publisher : John Wiley & Sons
Release : 2018-08-21
ISBN : 1119515351
Language : En, Es, Fr & De

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Book Description :

An indispensable guide for engineers and data scientists in design, testing, operation, manufacturing, and maintenance A road map to the current challenges and available opportunities for the research and development of Prognostics and Health Management (PHM), this important work covers all areas of electronics and explains how to: assess methods for damage estimation of components and systems due to field loading conditions assess the cost and benefits of prognostic implementations develop novel methods for in situ monitoring of products and systems in actual life-cycle conditions enable condition-based (predictive) maintenance increase system availability through an extension of maintenance cycles and/or timely repair actions; obtain knowledge of load history for future design, qualification, and root cause analysis reduce the occurrence of no fault found (NFF) subtract life-cycle costs of equipment from reduction in inspection costs, downtime, and inventory Prognostics and Health Management of Electronics also explains how to understand statistical techniques and machine learning methods used for diagnostics and prognostics. Using this valuable resource, electrical engineers, data scientists, and design engineers will be able to fully grasp the synergy between IoT, machine learning, and risk assessment.

Thermal Management for LED Applications

Thermal Management for LED Applications Book
Author : Clemens J.M. Lasance,András Poppe
Publisher : Springer Science & Business Media
Release : 2013-09-17
ISBN : 1461450918
Language : En, Es, Fr & De

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Book Description :

Thermal Management for LED Applications provides state-of-the-art information on recent developments in thermal management as it relates to LEDs and LED-based systems and their applications. Coverage begins with an overview of the basics of thermal management including thermal design for LEDs, thermal characterization and testing of LEDs, and issues related to failure mechanisms and reliability and performance in harsh environments. Advances and recent developments in thermal management round out the book with discussions on advances in TIMs (thermal interface materials) for LED applications, advances in forced convection cooling of LEDs, and advances in heat sinks for LED assemblies.

Solid State Lighting Reliability Part 2

Solid State Lighting Reliability Part 2 Book
Author : Willem Dirk van Driel,Xuejun Fan,Guo Qi Zhang
Publisher : Springer
Release : 2017-08-13
ISBN : 3319581759
Language : En, Es, Fr & De

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Book Description :

In the past four years we have witnessed rapid development in technology and significant market penetration in many applications for LED systems. New processes and new materials have been introduced; new standards and new testing methods have been developed; new driver, control and sensing technologies have been integrated; and new and unknown failure modes have also been presented. In this book, Solid State Lighting Reliability Part 2, we invited the experts from industry and academia to present the latest developments and findings in the LED system reliability arena. Topics in this book cover the early failures and critical steps in LED manufacturing; advances in reliability testing and standards; quality of colour and colour stability; degradation of optical materials and the associated chromaticity maintenance; characterization of thermal interfaces; LED solder joint testing and prediction; common failure modes in LED drivers; root causes for lumen depreciation; corrosion sensitivity of LED packages; reliability management for automotive LEDs, and lightning effects on LEDs. This book is a continuation of Solid State Lighting Reliability: Components to Systems (published in 2013), which covers reliability aspects ranging from the LED to the total luminaire or system of luminaires. Together, these two books are a full set of reference books for Solid State Lighting reliability from the performance of the (sub-) components to the total system, regardless its complexity.

Reliability Investigation of LED Devices for Public Light Applications

Reliability Investigation of LED Devices for Public Light Applications Book
Author : Raphael Baillot,Yannick Deshayes
Publisher : Elsevier
Release : 2017-03-09
ISBN : 0081010923
Language : En, Es, Fr & De

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Book Description :

Reliability Investigation of LED Devices for Public Light Applications focuses on state-of-the-art GaN-based LED technology through the study of typical failure mechanisms in public lighting applications. Across the different chapters, the reader will explore the tools and analyses involved in the study and application of a number of different LED devices. The authors review GaN-based LED technology by focusing on the main failure mechanisms targeting polymer-based packaging, thanks to electrical and spectral models. The proposed technology and methodologies will help those interested in the topic to further their knowledge of failure mechanisms, exploring the physical and chemical analyses involved. Based on the work of two main Phd results in 2011 and 2014 Describes GaN technology in the state-of-the-art, focusing on the specific electrical and spectral model Proposes the technology and methodologies to understand failure mechanisms

Microcircuit Reliability Bibliography

Microcircuit Reliability Bibliography Book
Author : Anonim
Publisher : Unknown
Release : 1978
ISBN : 0987650XXX
Language : En, Es, Fr & De

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Book Description :

Download Microcircuit Reliability Bibliography book written by , available in PDF, EPUB, and Kindle, or read full book online anywhere and anytime. Compatible with any devices.

Organosilicon Compounds

Organosilicon Compounds Book
Author : Vladimir Ya Lee
Publisher : Academic Press
Release : 2017-09-25
ISBN : 0128142146
Language : En, Es, Fr & De

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Book Description :

Organosilicon Compounds: Experiment (Physico-Chemical Studies) and Applications, volume 2, also contains two parts. In its first part, Experiment (Physico-Chemical Studies), the application of modern instrumental tools (such as X-ray crystallography, 29Si NMR spectroscopy, UV-Photoelectron Spectroscopy, and other methods) for assessing the structures of organosilicon compounds is described. The second part, Applications, reviews the current research in the field of material science, specifically the use of organosilicon compounds in synthetic chemistry directed towards the creation of new materials. Organosilicon Compounds: From Theory to Synthesis to Applications provides a comprehensive overview of this important area of organic and organometallic chemistry, dealing with compounds containing carbon–silicon bonds. This field, which includes compounds that are widely encountered in commercial products such as in the fabrication of sealants, adhesives, and coatings, has seen many milestone discoveries reported during the last two decades. Beginning with the theoretical aspects of organosilicon compounds’ structure and bonding, the book then explores their synthetic aspects, including main group element organosilicon compounds, transition metal complexes, silicon cages and clusters, low-coordinate organosilicon derivatives (cations, radicals, anions, multiple bonds to silicon, silaaromatics), and more. Next, readers will find valuable sections that explore physical and chemical properties of organosilicon compounds by means of X-ray crystallography, 29Si NMR spectroscopy, photoelectron spectroscopy, and other methods. Finally, the work delves into applications for industrial uses and in many related fields, such as polymers, material science, nanotechnology, bioorganics, and medicinal silicon chemistry. Features valuable contributions from prominent experts cover both fundamental (theoretical, synthetic, physico-chemical) and applied (material science, applications) aspects of modern organosilicon chemistry Covers important breakthroughs in the field as well as with the historically significant achievements of the past Includes applied information for a wide range of specialists from junior and senior researchers (from both academia and industry), working in organometallic, organosilicon, main group element, transition metal, and industrial silicon chemistry, as well as those from interdisciplinary fields such as polymer, material science, nanotechnology

From LED to Solid State Lighting

From LED to Solid State Lighting Book
Author : S. W. Ricky Lee,Jeffery C. C. Lo
Publisher : John Wiley & Sons
Release : 2021-11-15
ISBN : 1118881478
Language : En, Es, Fr & De

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Book Description :

A comprehensive reference including practical, hands-on exercises and data of experimental studies, written by leading researchers in the field • An introductory/intermediate level treatment including practical, hands-on exercises and data of experimental studies, written by leading researchers in the field • The authors lead a LED packaging R&D center with an industrial grade prototyping line and state-of-the-art facilities for materials/optical/electrical/thermal characterization. A substantial amount of technical contents in this book is based on the hands-on experience and experimental practices of the authors • The manufacture of LED-based luminaries for lighting is a huge area and there is a need for a comprehensive book instructing engineers and designers in the lighting industry • Includes packaging LED components such as interconnection, phosphor deposition, encapsulation, thermal management and reliability, making this an excellent reference and background reading for engineers and researchers

Component Reliability for Electronic Systems

Component Reliability for Electronic Systems Book
Author : Titu I. Băjenescu,Marius I. Bâzu
Publisher : Artech House
Release : 2010
ISBN : 1596934360
Language : En, Es, Fr & De

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Book Description :

The main reason for the premature breakdown of today's electronic products (computers, cars, tools, appliances, etc.) is the failure of the components used to build these products. Today professionals are looking for effective ways to minimize the degradation of electronic components to help ensure longer-lasting, more technically sound products and systems. This practical book offers engineers specific guidance on how to design more reliable components and build more reliable electronic systems. Professionals learn how to optimize a virtual component prototype, accurately monitor product reliability during the entire production process, and add the burn-in and selection procedures that are the most appropriate for the intended applications. Moreover, the book helps system designers ensure that all components are correctly applied, margins are adequate, wear-out failure modes are prevented during the expected duration of life, and system interfaces cannot lead to failure.

Failure Analysis

Failure Analysis Book
Author : Marius Bazu,Titu Bajenescu
Publisher : John Wiley & Sons
Release : 2011-03-08
ISBN : 9781119990000
Language : En, Es, Fr & De

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Book Description :

Failure analysis is the preferred method to investigate product or process reliability and to ensure optimum performance of electrical components and systems. The physics-of-failure approach is the only internationally accepted solution for continuously improving the reliability of materials, devices and processes. The models have been developed from the physical and chemical phenomena that are responsible for degradation or failure of electronic components and materials and now replace popular distribution models for failure mechanisms such as Weibull or lognormal. Reliability engineers need practical orientation around the complex procedures involved in failure analysis. This guide acts as a tool for all advanced techniques, their benefits and vital aspects of their use in a reliability programme. Using twelve complex case studies, the authors explain why failure analysis should be used with electronic components, when implementation is appropriate and methods for its successful use. Inside you will find detailed coverage on: a synergistic approach to failure modes and mechanisms, along with reliability physics and the failure analysis of materials, emphasizing the vital importance of cooperation between a product development team involved the reasons why failure analysis is an important tool for improving yield and reliability by corrective actions the design stage, highlighting the ‘concurrent engineering' approach and DfR (Design for Reliability) failure analysis during fabrication, covering reliability monitoring, process monitors and package reliability reliability resting after fabrication, including reliability assessment at this stage and corrective actions a large variety of methods, such as electrical methods, thermal methods, optical methods, electron microscopy, mechanical methods, X-Ray methods, spectroscopic, acoustical, and laser methods new challenges in reliability testing, such as its use in microsystems and nanostructures This practical yet comprehensive reference is useful for manufacturers and engineers involved in the design, fabrication and testing of electronic components, devices, ICs and electronic systems, as well as for users of components in complex systems wanting to discover the roots of the reliability flaws for their products.

Microelectronic Failure Analysis Desk Reference

Microelectronic Failure Analysis Desk Reference Book
Author : Anonim
Publisher : ASM International
Release : 2001-01-01
ISBN : 0871707454
Language : En, Es, Fr & De

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Book Description :

Developed by the Electronic Device Failure Analysis Society (EDFAS) Publications Committee.

The International Journal of Microcircuits and Electronic Packaging

The International Journal of Microcircuits and Electronic Packaging Book
Author : Anonim
Publisher : Unknown
Release : 2000
ISBN : 0987650XXX
Language : En, Es, Fr & De

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Book Description :

Download The International Journal of Microcircuits and Electronic Packaging book written by , available in PDF, EPUB, and Kindle, or read full book online anywhere and anytime. Compatible with any devices.

Reliability of High Power Mechatronic Systems 2

Reliability of High Power Mechatronic Systems 2 Book
Author : Abdelkhalak El Hami,David Delaux,Henri Grzeskowiak
Publisher : Elsevier
Release : 2017-10-17
ISBN : 0081024231
Language : En, Es, Fr & De

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Book Description :

This second volume of a series dedicated to the reliability of high-power mechatronic systems focuses specifically on issues, testing and analysis in automotive and aerospace applications. In the search to improve industrial competitiveness, the development of methods and tools for the design of products is especially pertinent in the context of cost reduction. This book proposes new methods that simultaneously allow for a quicker design of future mechatronic devices in the automotive and aerospace industries while guaranteeing their increased reliability. The reliability of these critical elements is further validated digitally through new multi-physical and probabilistic models that could ultimately lead to new design standards and reliable forecasting. Presents a methodological guide that demonstrates the reliability of fractured mechatronic components and devices Includes numerical and statistical models to optimize the reliability of the product architecture Develops a methodology to characterize critical elements at the earliest stage in their development

Reliability of RoHS Compliant 2D and 3D IC Interconnects

Reliability of RoHS Compliant 2D and 3D IC Interconnects Book
Author : John Lau
Publisher : McGraw Hill Professional
Release : 2010-10-22
ISBN : 007175380X
Language : En, Es, Fr & De

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Book Description :

Proven 2D and 3D IC lead-free interconnect reliability techniques Reliability of RoHS-Compliant 2D and 3D IC Interconnects offers tested solutions to reliability problems in lead-free interconnects for PCB assembly, conventional IC packaging, 3D IC packaging, and 3D IC integration. This authoritative guide presents the latest cutting-edge reliability methods and data for electronic manufacturing services (EMS) on second-level interconnects, packaging assembly on first-level interconnects, and 3D IC integration on microbumps and through-silicon-via (TSV) interposers. Design reliable 2D and 3D IC interconnects in RoHS-compliant projects using the detailed information in this practical resource. Covers reliability of: 2D and 3D IC lead-free interconnects CCGA, PBGA, WLP, PQFP, flip-chip, lead-free SAC solder joints Lead-free (SACX) solder joints Low-temperature lead-free (SnBiAg) solder joints Solder joints with voids, high strain rate, and high ramp rate VCSEL and LED lead-free interconnects 3D LED and 3D MEMS with TSVs Chip-to-wafer (C2W) bonding and lead-free interconnects Wafer-to-wafer (W2W) bonding and lead-free interconnects 3D IC chip stacking with low-temperature bonding TSV interposers and lead-free interconnects Electromigration of lead-free microbumps for 3D IC integration

Proceedings of the International Symposium on Microelectronics

Proceedings of the     International Symposium on Microelectronics Book
Author : Anonim
Publisher : Unknown
Release : 2002
ISBN : 0987650XXX
Language : En, Es, Fr & De

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Book Description :

Download Proceedings of the International Symposium on Microelectronics book written by , available in PDF, EPUB, and Kindle, or read full book online anywhere and anytime. Compatible with any devices.