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Reflow Soldering Processes and Troubleshooting

Reflow Soldering Processes and Troubleshooting Book
Author : Ning-Cheng Lee
Publisher : Newnes
Release : 2002-01
ISBN : 0750672188
Language : En, Es, Fr & De

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Book Description :

Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, Reflow Soldering Processes and Troubleshooting will be a strong contender in the continuing skill development market for manufacturing personnel. Written using a very practical, hands-on approach, Reflow Soldering Processes and Troubleshooting provides the means for engineers to increase their understanding of the principles of soldering, flux, and solder paste technology. The author facilitates learning about other essential topics, such as area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and rework process,--and provides an increased understanding of the reliability failure modes of soldered SMT components. With cost effectiveness foremost in mind, this book is designed to troubleshoot errors or problems before boards go into the manufacturing process, saving time and money on the front end. The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes. Comprehensive and indispensable, this book will prove a perfect training and reference tool that readers will find invaluable. Provides engineers the cutting-edge technology in a rapidly changing field Offers in-depth coverage of the principles of soldering, flux, solder paste technology, area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and the rework process

Reflow Soldering

Reflow Soldering Book
Author : Balázs Illés,Oliver Krammer,Attila Geczy
Publisher : Elsevier
Release : 2020-07-02
ISBN : 0128185066
Language : En, Es, Fr & De

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Book Description :

Reflow Soldering: Apparatus and Heat Transfer Processes investigates the technology of reflow soldering from the aspect of the soldering ovens and apparatus. The authors begin by introducing the concept of surface mount technology. This is followed by three chapters exploring: Infrared ovens, convection ovens, Vapor Phase Soldering (VPS), and special reflow ovens. Each of these chapters includes a discussion of the physical background, structure and working principle, and characterization of the heating, flow and vapor parameters; and concludes with a review of the application of the techniques and typical solder failures. The book concludes with a discussion of the various numerical simulations of the different ovens. This book will be useful for researchers and process and quality and research and design engineers within the electronics and manufacturing industries. Provides an overview and comparison of the existing reflow apparatus, heating methods, and working principles Analyses and compares the different reflow ovens Discusses useful tools such as characterization and measurement methods and includes numerical case studies to assist in solving soldering problems and improve soldering quality Introduces Vapor Phase Soldering (VPS) technology

Mechanics of Solder Alloy Interconnects

Mechanics of Solder Alloy Interconnects Book
Author : Darrel R. Frear,Steven N. Burchett,Harold S. Morgan,John H. Lau
Publisher : Springer Science & Business Media
Release : 1994-01-31
ISBN : 9780442015053
Language : En, Es, Fr & De

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Book Description :

The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to be used as a stand-alone resource for a particular aspect of materials and modeling issues. With this gained understanding, the reader in search of a solution to a solder joint reliability problem knows where in the materials and modeling communities to go for the appropriate answer.

Lead Free Soldering in Electronics

Lead Free Soldering in Electronics Book
Author : Katsuaki Suganuma
Publisher : CRC Press
Release : 2003-12-11
ISBN : 0824758595
Language : En, Es, Fr & De

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Book Description :

Assessing the scientific and technological aspects of lead-free soldering, Lead-Free Soldering in Electronics considers the necessary background and requirements for proper alloy selection. It highlights the metallurgical and mechanical properties; plating and processing technologies; and evaluation methods vital to the production of lead-free solders in electronics. A valuable resource for those interested in promoting environmentally-conscious electronic packaging practices! Responding to increasing environmental and health concerns over lead toxicity, Lead-Free Soldering in Electronics discusses: Soldering inspection and design Mechanical evaluation in electronics Lead-free solder paste and reflow soldering Wave soldering Plating lead-free soldering in electronics Lead-Free Soldering in Electronics will benefit manufacturing, electronics, and mechanical engineers, as well as undergraduate and graduate students in these disciplines.

Soldering Handbook For Printed Circuits and Surface Mounting

Soldering Handbook For Printed Circuits and Surface Mounting Book
Author : Howard H. Manko
Publisher : Springer Science & Business Media
Release : 1995-10-31
ISBN : 9780442012069
Language : En, Es, Fr & De

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Book Description :

Soldering Handbook for Printed Circuits and Surface Mounting, Second Edition, covers every aspect of this packaging technology, and contains the latest information on design, presolder operations, materials, equipment, surface mount technology, cleaning, quality and inspection, touch-up and repair, process economy, line management, and more.

Solder Paste in Electronics Packaging

Solder Paste in Electronics Packaging Book
Author : Jennie S. Hwang
Publisher : Springer Science & Business Media
Release : 2012-12-06
ISBN : 9401160503
Language : En, Es, Fr & De

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Book Description :

One of the strongest trends in the design and manufacture of modern electronics packages and assemblies is the utilization of surface mount technology as a replacement for through-hole tech nology. The mounting of electronic devices and components onto the surface of a printed wiring board or other substrate offers many advantages over inserting the leads of devices or components into holes. From the engineering viewpoint, much higher lead counts with shorter wire and interconnection lengths can be accommo dated. This is critical in high performance modern electronics packaging. From the manufacturing viewpoint, the application of automated assembly and robotics is much more adaptable to high lead count surface mounted devices and components. Indeed, the insertion of high lead count parts into fine holes on a substrate might often be nearly impossible. Yet, in spite of these surface mounting advantages, the utilization of surface mount technology is often a problem, primarily due to soldering problems. The most practical soldering methods use solder pastes, whose intricacies are frequently not understood by most of those involved in the engineering and manufacture of electronics assemblies. This publication is the first book devoted exclusively to explanations of the broad combination of the chemical, metallurgical, and rheological principles that are critical to the successful use of solder pastes. The critical relation ships between these characteristics are clearly explained and pre sented. In this excellent presentation, Dr. Hwang highlights three impor tant areas of solder paste technology.

Advanced Manufacturing and Information Engineering Intelligent Instrumentation and Industry Development

Advanced Manufacturing and Information Engineering  Intelligent Instrumentation and Industry Development Book
Author : J.Z. Ma,Fang Shao,L.P. Hu,J. Liu,D.M. Chen
Publisher : Trans Tech Publications Ltd
Release : 2014-08-11
ISBN : 3038265772
Language : En, Es, Fr & De

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Book Description :

Collection of selected, peer reviewed papers from the 2014 2nd International Conference on Precision Mechanical Instruments and Measurement Technology (ICPMIMT 2014), May 30-31, 2014, Chongqing, China. The 885 papers are grouped as follows: Chapter 1: Mechanics and Dynamics, Applied Mechanics, Advanced Development in Manufacturing and Industry Engineering, Chapter 2: Mechatronics, Automation and Control, Intelligent Algorithms for Automation and Control, Chapter 3: Measurement and Instrumentation, Monitoring, Testing, Detection, Recognition and Identification Technologies, Chapter 4: Power and Electric Research, Electronics and Microelectronics, Embedded and Integrated Systems, Chapter 5: Algorithms, Computation and Information Technologies

Handbook of Wafer Bonding

Handbook of Wafer Bonding Book
Author : Peter Ramm,James Jian-Qiang Lu,Maaike M. V. Taklo
Publisher : John Wiley & Sons
Release : 2011-11-17
ISBN : 3527644237
Language : En, Es, Fr & De

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Book Description :

The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies. Part I sorts the wafer bonding technologies into four categories: Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies. This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries.

Micro and Opto Electronic Materials and Structures Physics Mechanics Design Reliability Packaging

Micro  and Opto Electronic Materials and Structures  Physics  Mechanics  Design  Reliability  Packaging Book
Author : Ephraim Suhir,Y.C. Lee,C.P. Wong
Publisher : Springer Science & Business Media
Release : 2007-05-26
ISBN : 0387329897
Language : En, Es, Fr & De

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Book Description :

This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.

Cleaning Printed Wiring Assemblies in Today s Environment

Cleaning Printed Wiring Assemblies in Today   s Environment Book
Author : L. Hymes
Publisher : Springer Science & Business Media
Release : 2012-12-06
ISBN : 9401169675
Language : En, Es, Fr & De

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Book Description :

The impetus to create this book originated from several concerns. One of these was the perceived value to the industry of a collection in one volume of a wide range of information pertinent to the reasons and techniques for de fluxing printed wiring assemblies (PWAs). This book is expected to be of use not only to those engaged in the electronics packaging industry but also to those in related fields seeking information concerning viable methods of dealing with one of the en vironmental issues of our time: the destruction of the ozone layer surrounding and protecting the planet with which we have been entrusted. The volume of information relative to providing PW As free of residues ad versely impacting operation, reliability, and life of electronic products is grow ing, and it will continue to expand at an accelerated rate as we seek to match our technology needs and desires with our environmental responsibilities. At the time ofthis writing, which has spanned the latter portion of 1989 and early 1990, the issue of choosing a new approach to producing PW As free of detrimental residues while using environmentally acceptable manufacturing techniques ap peared to be the major concern of the vast majority of those involved in the printed wiring assembly industry. To many this meant the use of different clean ing media and/or process or equipment enhancements; to others it meant the elimination of the need to clean through materials or process changes.

Handbook of Lead Free Solder Technology for Microelectronic Assemblies

Handbook of Lead Free Solder Technology for Microelectronic Assemblies Book
Author : Karl J. Puttlitz,Kathleen A. Stalter
Publisher : CRC Press
Release : 2004-02-27
ISBN : 082475249X
Language : En, Es, Fr & De

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Book Description :

This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specific to the tin-rich replacement alloys commonly utilized in lead-free solders. It provides real-world manufacturing accounts of the introduction of reduced-lead and lead-free technology and discusses the functionality and cost effectiveness of alternative solder alloys and non-solder alternatives replacing lead-tin solders in microelectronics.

Lead Free Solder Process Development

Lead Free Solder Process Development Book
Author : Gregory Henshall,Jasbir Bath,Carol A. Handwerker
Publisher : John Wiley & Sons
Release : 2011-03-29
ISBN : 9781118102749
Language : En, Es, Fr & De

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Book Description :

Discusses the growth mechanisms of tin whiskers and the effective mitigation strategies necessary to reduce whisker growth risks This book covers key tin whisker topics, ranging from fundamental science to practical mitigation strategies. The text begins with a review of the characteristic properties of local microstructures around whisker and hillock grains to identify why these particular grains and locations become predisposed to forming whiskers and hillocks. The book discusses the basic properties of tin-based alloy finishes and the effects of various alloying elements on whisker formation, with a focus on potential mechanisms for whisker suppression or enhancement for each element. Tin whisker risk mitigation strategies for each tier of the supply chain for high reliability electronic systems are also described. Discusses whisker formation factors including surface grain geometry, crystallographic orientation-dependent surface grain boundary structure, and the localization of elastic strain/strain energy density distribution Examines how whiskers and hillocks evolve in time through real-time studies of whisker growth with the scanning electron microscope/focused ion beaming milling (SEM/FIB) Covers characterization methods of tin and tin-based alloy finishes such as transmission electron microscopy (TEM), scanning electron microscopy (SEM), and electron backscatter diffraction (EBSD) Reviews theories of mechanically-induced tin whiskers with case studies using pure tin and other lead-free finishes shown to evaluate the pressure-induced tin whiskers Mitigating Tin Whisker Risks: Theory and Practice is intended for the broader electronic packaging and manufacturing community including: manufacturing engineers, packaging development engineers, as well as engineers and researchers in high reliability industries.

The Electrical Engineering Handbook Second Edition

The Electrical Engineering Handbook Second Edition Book
Author : Richard C. Dorf
Publisher : CRC Press
Release : 1997-09-26
ISBN : 9781420049763
Language : En, Es, Fr & De

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Book Description :

In 1993, the first edition of The Electrical Engineering Handbook set a new standard for breadth and depth of coverage in an engineering reference work. Now, this classic has been substantially revised and updated to include the latest information on all the important topics in electrical engineering today. Every electrical engineer should have an opportunity to expand his expertise with this definitive guide. In a single volume, this handbook provides a complete reference to answer the questions encountered by practicing engineers in industry, government, or academia. This well-organized book is divided into 12 major sections that encompass the entire field of electrical engineering, including circuits, signal processing, electronics, electromagnetics, electrical effects and devices, and energy, and the emerging trends in the fields of communications, digital devices, computer engineering, systems, and biomedical engineering. A compendium of physical, chemical, material, and mathematical data completes this comprehensive resource. Every major topic is thoroughly covered and every important concept is defined, described, and illustrated. Conceptually challenging but carefully explained articles are equally valuable to the practicing engineer, researchers, and students. A distinguished advisory board and contributors including many of the leading authors, professors, and researchers in the field today assist noted author and professor Richard Dorf in offering complete coverage of this rapidly expanding field. No other single volume available today offers this combination of broad coverage and depth of exploration of the topics. The Electrical Engineering Handbook will be an invaluable resource for electrical engineers for years to come.

Soldering Processes and Equipment

Soldering Processes and Equipment Book
Author : Michael Pecht
Publisher : John Wiley & Sons
Release : 1993-06-18
ISBN : 9780471591672
Language : En, Es, Fr & De

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Book Description :

Addresses the key aspects of modern soldering technology and the methods used in the manufacturing process of microelectronic chips and electronic circuit boards. Demonstrates how to control contamination during cleaning procedures. Covers material dynamics of heat soldering incurred during the assembly of diverse substances. Features techniques to assure reliability and quality control during the manufacturing process and emphasizes the importance of rework in the soldering industry.

Failure Modes and Mechanisms in Electronic Packages

Failure Modes and Mechanisms in Electronic Packages Book
Author : P. Singh,Puligandla Viswanadham
Publisher : Springer Science & Business Media
Release : 1997-11-30
ISBN : 9780412105913
Language : En, Es, Fr & De

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Book Description :

With the proliferation of packaging technology, failure and reliability have become serious concerns. This invaluable reference details processes that enable detection, analysis and prevention of failures. It provides a comprehensive account of the failures of device packages, discrete component connectors, PCB carriers and PCB assemblies.

Lead Free Soldering

Lead Free Soldering Book
Author : Jasbir Bath
Publisher : Springer Science & Business Media
Release : 2007-06-26
ISBN : 0387684220
Language : En, Es, Fr & De

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Book Description :

The worldwide trend toward lead-free components and soldering is especially urgent in the European Union with the implementation strict new standards in July 2006, and with pending implementation of laws in China and California. This book provides a standard reference guide for engineers who must meet the new regulations, including a broad collection of techniques for lead-free soldering design and manufacture, which up to now have been scattered in difficult-to-find scholarly sources.