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Plasma Etching Processes For Interconnect Realization In Vlsi

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Plasma Etching Processes for Interconnect Realization in VLSI

Plasma Etching Processes for Interconnect Realization in VLSI Book
Author : Nicolas Posseme
Publisher : Elsevier
Release : 2015-04-14
ISBN : 0081005903
Language : En, Es, Fr & De

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Book Description :

This is the first of two books presenting the challenges and future prospects of plasma etching processes for microelectronics, reviewing the past, present and future issues of etching processes in order to improve the understanding of these issues through innovative solutions. This book focuses on back end of line (BEOL) for high performance device realization and presents an overview of all etch challenges for interconnect realization as well as the current etch solutions proposed in the semiconductor industry. The choice of copper/low-k interconnect architecture is one of the keys for integrated circuit performance, process manufacturability and scalability. Today, implementation of porous low-k material is mandatory in order to minimize signal propagation delay in interconnections. In this context, the traditional plasma process issues (plasma-induced damage, dimension and profile control, selectivity) and new emerging challenges (residue formation, dielectric wiggling) are critical points of research in order to control the reliability and reduce defects in interconnects. These issues and potential solutions are illustrated by the authors through different process architectures available in the semiconductor industry (metallic or organic hard mask strategies). Presents the difficulties encountered for interconnect realization in very large-scale integrated (VLSI) circuits Focused on plasma-dielectric surface interaction Helps you further reduce the dielectric constant for the future technological nodes

Low Energy Electrons

Low Energy Electrons Book
Author : Oddur Ingólfsson
Publisher : CRC Press
Release : 2019-04-23
ISBN : 0429608284
Language : En, Es, Fr & De

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Book Description :

Low-energy electrons are ubiquitous in nature and play an important role in natural phenomena as well as many potential and current industrial processes. Authored by 16 active researchers, this book describes the fundamental characteristics of low-energy electron–molecule interactions and their role in different fields of science and technology, including plasma processing, nanotechnology, and health care, as well as astro- and atmospheric physics and chemistry. The book is packed with illustrative examples, from both fundamental and application sides, features about 130 figures, and lists over 800 references. It may serve as an advanced graduate-level study course material where selected chapters can be used either individually or in combination as a basis to highlight and study specific aspects of low-energy electron–molecule interactions. It is also directed at researchers in the fields of plasma physics, nanotechnology, and radiation damage to biologically relevant material (such as in cancer therapy), especially those with an interest in high-energy-radiation-induced processes, from both an experimental and a theoretical point of view.

Atomic Molecular Ionization by Electron Scattering

Atomic Molecular Ionization by Electron Scattering Book
Author : K. N. Joshipura,Nigel Mason
Publisher : Cambridge University Press
Release : 2018-06-30
ISBN : 1108574750
Language : En, Es, Fr & De

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Book Description :

Comprehensive and up-to-date text in the field of electron scattering and ionization, covering fundamentals, experimental background, quantum scattering theories and applications. Electron impact ionization of atoms and molecules in ground/metastable states is discussed comprehensively. The text covers electron scattering phenomenon for diatomic and common molecules, polyatomic molecules and radicals including hydro-carbons, fluoro-carbons and other larger molecules together with relevant radical species in detail. Applications of electron impact ionization and excitation in gaseous or plasma and condensed matter is discussed in a separate chapter. Recent advances in the field of electron molecule scattering and ionization for polyatomic molecules is covered extensively.

Advances in Atomic Molecular and Optical Physics

Advances in Atomic  Molecular  and Optical Physics Book
Author : Anonim
Publisher : Academic Press
Release : 2017-06-07
ISBN : 012812184X
Language : En, Es, Fr & De

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Book Description :

Advances in Atomic, Molecular, and Optical Physics, Volume 66, provides a comprehensive compilation of recent developments in a field that is in a state of rapid growth as new experimental and theoretical techniques are used on many problems, both old and new. Topics covered include related applied areas, such as atmospheric science, astrophysics, surface physics, and laser physics, with timely articles written by distinguished experts that contain relevant review materials and detailed descriptions of important developments in the field. Presents the work of international experts in the field Contains comprehensive articles that compile recent developments in a field that is experiencing rapid growth, with new experimental and theoretical techniques emerging Ideal for users interested in optics, excitons, plasmas, and thermodynamics Topics covered include atmospheric science, astrophysics, surface physics, and laser physics, amongst others

Plasma Etching Processes for CMOS Devices Realization

Plasma Etching Processes for CMOS Devices Realization Book
Author : Nicolas Posseme
Publisher : Elsevier
Release : 2017-01-25
ISBN : 0081011962
Language : En, Es, Fr & De

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Book Description :

Plasma etching has long enabled the perpetuation of Moore's Law. Today, etch compensation helps to create devices that are smaller than 20 nm. But, with the constant downscaling in device dimensions and the emergence of complex 3D structures (like FinFet, Nanowire and stacked nanowire at longer term) and sub 20 nm devices, plasma etching requirements have become more and more stringent. Now more than ever, plasma etch technology is used to push the limits of semiconductor device fabrication into the nanoelectronics age. This will require improvement in plasma technology (plasma sources, chamber design, etc.), new chemistries (etch gases, flows, interactions with substrates, etc.) as well as a compatibility with new patterning techniques such as multiple patterning, EUV lithography, Direct Self Assembly, ebeam lithography or nanoimprint lithography. This book presents these etch challenges and associated solutions encountered throughout the years for transistor realization. Helps readers discover the master technology used to pattern complex structures involving various materials Explores the capabilities of cold plasmas to generate well controlled etched profiles and high etch selectivities between materials Teaches users how etch compensation helps to create devices that are smaller than 20 nm

Fabrication of Two dimensional and Three dimensional Photonic Crystal Devices for Applications in Chip scale Optical Interconnects

Fabrication of Two dimensional and Three dimensional Photonic Crystal Devices for Applications in Chip scale Optical Interconnects Book
Author : Anonim
Publisher : Unknown
Release : 2006
ISBN : 0987650XXX
Language : En, Es, Fr & De

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Book Description :

To date, the realization of chip-scale optical interconnects has been inhibited by the lack of a device technology that can provide optical functionality at a scale commensurate with integrated circuits. To overcome this limitation, I propose the realization of an "optical superhighway" as an alternative interconnect paradigm for next-generation integrated circuits using semiconductor-based photonic-crystal (PhC) devices. PhCs have the potential to be the elementary building blocks of the next generation of opto-electronic devices and integrated circuits. This potential has invigorated global research interest in hybrid optical-electrical interconnects at the chip scale. In this thesis, I will present the development of such Nano-Photonic Crystal (PhC) interconnects using conventional CMOS fabrication technology, thereby enabling photonic functionality on the VLSI scale. Accordingly, I will discuss the fabrication of high fill-factor planar PhC devices on silicon-on-insulator substrates, using both capacitively coupled and inductively coupled plasma etching. Functional, sub-100-nm, high-aspect-ratio PhC devices will be presented, along with the technical challenges encountered in their realization. Also, a robust etch-process toolbox has been developed that, in addition to realizing chip-scale optical interconnects, also paves the way for applications in other technology niches like MEMS, terahertz devices, nanophotonics and microfluidics, to be realized in a single silicon platform, thus enabling systems-on-a-chip. In-plane optical routing in ultra-thin silicon-on-sapphire is also explored as part of this investigation. In addition, I will discuss the development of a sub-surface silicon optical bus (S3B), a buried silicon optical interconnect technology. The approach relies on engineering the dispersion properties of three-dimensional (3D) photonic crystals embedded in silicon to control light propagation. In particular, a novel method of fabricating buried 3D photonic-crystal structures using conventional planar silicon micromachining will be presented. This method utilizes a single planar etch mask and time-multiplexed etch process along with sidewall oxidation to create an array of spherical voids with three-dimensional symmetry. Preliminary results will be presented to support the feasibility of realizing chip-scale optical interconnects using the proposed approach. The results of this research will not only help realize a new generation of optical integrated circuits, but also provide a solution to the global interconnect delay anticipated in next-generation of high-end integrated circuits. These PhC devices could very well provide the building blocks for the integrated circuits of the future.

Proceedings International IEEE VLSI Multilevel Interconnection Conference

Proceedings      International IEEE VLSI Multilevel Interconnection Conference Book
Author : Anonim
Publisher : Unknown
Release : 1989
ISBN : 0987650XXX
Language : En, Es, Fr & De

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Book Description :

Download Proceedings International IEEE VLSI Multilevel Interconnection Conference book written by , available in PDF, EPUB, and Kindle, or read full book online anywhere and anytime. Compatible with any devices.

1986 Proceedings

1986 Proceedings Book
Author : Anonim
Publisher : Unknown
Release : 1986
ISBN : 0987650XXX
Language : En, Es, Fr & De

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Book Description :

Download 1986 Proceedings book written by , available in PDF, EPUB, and Kindle, or read full book online anywhere and anytime. Compatible with any devices.

Extended Abstracts

Extended Abstracts Book
Author : Electrochemical Society
Publisher : Unknown
Release : 1992
ISBN : 0987650XXX
Language : En, Es, Fr & De

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Book Description :

Download Extended Abstracts book written by Electrochemical Society, available in PDF, EPUB, and Kindle, or read full book online anywhere and anytime. Compatible with any devices.

Proceedings

Proceedings Book
Author : Anonim
Publisher : Unknown
Release : 1985
ISBN : 0987650XXX
Language : En, Es, Fr & De

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Book Description :

Download Proceedings book written by , available in PDF, EPUB, and Kindle, or read full book online anywhere and anytime. Compatible with any devices.

VLSI Electronics

VLSI Electronics Book
Author : D B Clayson
Publisher : Elsevier
Release : 2014-06-28
ISBN : 1483297802
Language : En, Es, Fr & De

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Book Description :

VLSI Electronics

1985 Proceedings

1985 Proceedings Book
Author : Anonim
Publisher : Unknown
Release : 1985
ISBN : 0987650XXX
Language : En, Es, Fr & De

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Book Description :

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Eighth International IEEE VLSI Multilevel Interconnection Conference 1991

Eighth International IEEE VLSI Multilevel Interconnection Conference  1991 Book
Author : IEEE Electron Devices Society
Publisher : Institute of Electrical & Electronics Engineers(IEEE)
Release : 1991-06
ISBN : 0987650XXX
Language : En, Es, Fr & De

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Book Description :

Download Eighth International IEEE VLSI Multilevel Interconnection Conference 1991 book written by IEEE Electron Devices Society, available in PDF, EPUB, and Kindle, or read full book online anywhere and anytime. Compatible with any devices.

1987 Proceedings

1987 Proceedings Book
Author : Anonim
Publisher : Unknown
Release : 1987
ISBN : 0987650XXX
Language : En, Es, Fr & De

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Book Description :

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Dissertation Abstracts International

Dissertation Abstracts International Book
Author : Anonim
Publisher : Unknown
Release : 2006
ISBN : 0987650XXX
Language : En, Es, Fr & De

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Book Description :

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IEDM Technical Digest

IEDM Technical Digest Book
Author : Anonim
Publisher : Unknown
Release : 1987
ISBN : 0987650XXX
Language : En, Es, Fr & De

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Book Description :

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Optical Microlithography and Metrology for Microcircuit Fabrication

Optical Microlithography and Metrology for Microcircuit Fabrication Book
Author : Michel J. Lacombat,Steve Wittekoek
Publisher : Society of Photo Optical
Release : 1989
ISBN : 0987650XXX
Language : En, Es, Fr & De

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Book Description :

Download Optical Microlithography and Metrology for Microcircuit Fabrication book written by Michel J. Lacombat,Steve Wittekoek, available in PDF, EPUB, and Kindle, or read full book online anywhere and anytime. Compatible with any devices.

Japanese Journal of Applied Physics

Japanese Journal of Applied Physics Book
Author : Anonim
Publisher : Unknown
Release : 1998
ISBN : 0987650XXX
Language : En, Es, Fr & De

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The GEC Journal of Research

The GEC Journal of Research Book
Author : Anonim
Publisher : Unknown
Release : 1983
ISBN : 0987650XXX
Language : En, Es, Fr & De

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Metals Abstracts

Metals Abstracts Book
Author : Anonim
Publisher : Unknown
Release : 1994
ISBN : 0987650XXX
Language : En, Es, Fr & De

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Book Description :

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