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Microjoining And Nanojoining

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Microjoining and Nanojoining

Microjoining and Nanojoining Book
Author : Y N Zhou
Publisher : Elsevier
Release : 2008-03-27
ISBN : 184569404X
Language : En, Es, Fr & De

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Book Description :

Many important advances in technology have been associated with nanotechnology and the miniaturization of components, devices and systems. Microjoining has been closely associated with the evolution of microelectronic packaging, but actually covers a much broader area, and is essential for manufacturing many electronic, precision and medical products. Part one reviews the basics of microjoining, including solid-state bonding and fusion microwelding. Part two covers microjoining and nanojoining processes, such as bonding mechanisms and metallurgy, process development and optimization, thermal stresses and distortion, positioning and fixturing, sensing, and numerical modelling. Part three discusses microjoining of materials such as plastics, ceramics, metals and advanced materials such as shape memory alloys and nanomaterials. The book also discusses applications of microjoining such as joining superconductors, the manufacture of medical devices and the sealing of solid oxide fuel cells. This book provides a comprehensive overview of the fundamental aspects of microjoining processes and techniques. It is a valuable reference for production engineers, designers and researchers using or studying microjoining technologies in such industries as microelectronics and biomedical engineering. Reviews the basics of nanojoining including solid-state bonding and fusion microwelding Covers microjoining and nanojoining processes such as bonding mechanisms and metallurgy, sensing and numerical modelling Examines applications of microjoining such as the manufacturing of medical devices, and the sealing of solid oxide fuel cells

Solid State Hydrogen Storage

Solid State Hydrogen Storage Book
Author : Gavin Walker
Publisher : Elsevier
Release : 2008-09-30
ISBN : 1845694945
Language : En, Es, Fr & De

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Book Description :

Hydrogen fuel cells are emerging as a major alternative energy source in transportation and other applications. Central to the development of the hydrogen economy is safe, efficient and viable storage of hydrogen. Solid-state hydrogen storage: Materials and chemistry reviews the latest developments in solid-state hydrogen storage. Part one discusses hydrogen storage technologies, hydrogen futures, hydrogen containment materials and solid-state hydrogen storage system design. Part two reviews the analysis of hydrogen interactions including structural characterisation of hydride materials, neutron scattering techniques, reliably measuring hydrogen uptake in storage materials and modelling of carbon-based materials for hydrogen storage. Part three analyses physically-bound hydrogen storage with chapters on zeolites, carbon nanostructures and metal-organic framework materials. Part four examines chemically-bound hydrogen storage including intermetallics, magnesium hydride, alanates, borohydrides, imides and amides, multicomponent hydrogen storage systems, organic liquid carriers, indirect hydrogen storage in metal ammines and technological challenges in hydrogen storage. With its distinguished editor and international team of contributors, Solid-state hydrogen storage: Materials and chemistry is a standard reference for researchers and professionals in the field of renewable energy, hydrogen fuel cells and hydrogen storage. Assesses hydrogen fuel cells as a major alternative energy source Discusses hydrogen storage technologies and solid-state hydrogen storage system design Explores the analysis of hydrogen interactions including reliably measuring hydrogen uptake in storage materials

Advanced Piezoelectric Materials

Advanced Piezoelectric Materials Book
Author : Kenji Uchino
Publisher : Elsevier
Release : 2010-09-27
ISBN : 1845699750
Language : En, Es, Fr & De

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Book Description :

Piezoelectric materials produce electric charges on their surfaces as a consequence of applying mechanical stress. They are used in the fabrication of a growing range of devices such as transducers (used, for example, in ultrasound scanning), actuators (deployed in such areas as vibration suppression in optical and microelectronic engineering), pressure sensor devices (such as gyroscopes) and increasingly as a way of producing energy. Their versatility has led to a wealth of research to broaden the range of piezoelectric materials and their potential uses. Advanced piezoelectric materials: science and technology provides a comprehensive review of these new materials, their properties, methods of manufacture and applications. After an introductory overview of the development of piezoelectric materials, Part one reviews the various types of piezoelectric material, ranging from lead zirconate titanate (PZT) piezo-ceramics, relaxor ferroelectric ceramics, lead-free piezo-ceramics, quartz-based piezoelectric materials, the use of lithium niobate and lithium in piezoelectrics, single crystal piezoelectric materials, electroactive polymers (EAP) and piezoelectric composite materials. Part two discusses how to design and fabricate piezo-materials with chapters on piezo-ceramics, single crystal preparation techniques, thin film technologies, aerosol techniques and manufacturing technologies for piezoelectric transducers. The final part of the book looks at applications such as high-power piezoelectric materials and actuators as well as the performance of piezoelectric materials under stress. With its distinguished editor and international team of expert contributors Advanced piezoelectric materials: science and technology is a standard reference for all those researching piezoelectric materials and using them to develop new devices in such areas as microelectronics, optical, sound, structural and biomedical engineering. Provides a comprehensive review of the new materials, their properties and methods of manufacture and application Explores the development of piezoelectric materials from the historical background to the present status Features an overview of manufacturing methods for piezoelectric ceramic materials including design considerations

Joining Processes for Dissimilar and Advanced Materials

Joining Processes for Dissimilar and Advanced Materials Book
Author : Pawan Kumar Rakesh,J. Paulo Davim
Publisher : Woodhead Publishing
Release : 2021-11-13
ISBN : 0323860206
Language : En, Es, Fr & De

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Book Description :

Joining Processes for Dissimilar and Advanced Materials describes how to overcome the many challenges involved in the joining of similar and dissimilar materials resulting from factors including different thermal coefficients and melting points. Traditional joining processes are ineffective with many newly developed materials. The ever-increasing industrial demands for production efficiency and high-performance materials are also pushing this technology forward. The resulting emergence of advanced micro- and nanoscale material joining technologies, have provided many solutions to these challenges. Drawing on the latest research, this book describes primary and secondary processes for the joining of advanced materials such as metals and alloys, intermetallics, ceramics, glasses, polymers, superalloys, electronic materials and composites in similar and dissimilar combinations. It also covers details of joint design, quality assurance, economics and service life of the product. Provides valuable information on innovative joining technologies including induction heating of metals, ultrasonic heating, and laser heating at micro- and nanoscale levels Describes the newly developed modelling, simulation and digitalization of the joining process Includes a methodology for characterization of joints

Advanced Adhesives in Electronics

Advanced Adhesives in Electronics Book
Author : M O Alam,C Bailey
Publisher : Elsevier
Release : 2011-05-25
ISBN : 0857092898
Language : En, Es, Fr & De

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Book Description :

Adhesives for electronic applications serve important functional and structural purposes in electronic components and packaging, and have developed significantly over the last few decades. Advanced adhesives in electronics reviews recent developments in adhesive joining technology, processing and properties. The book opens with an introduction to adhesive joining technology for electronics. Part one goes on to cover different types of adhesive used in electronic systems, including thermally conductive adhesives, isotropic and anisotropic conductive adhesives and underfill adhesives for flip-chip applications. Part two focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces, modelling techniques used to assess adhesive properties and adhesive technology for photonics. With its distinguished editors and international team of contributors, Advanced adhesives in electronics is a standard reference for materials scientists, engineers and chemists using adhesives in electronics, as well as those with an academic research interest in the field. Reviews recent developments in adhesive joining technology, processing and properties featuring flip-chip applications Provides a comprehensive overview of adhesive joining technology for electronics including different types of adhesives used in electronic systems Focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces and modelling techniques

Nano Bio Electronic Photonic and MEMS Packaging

Nano Bio  Electronic  Photonic and MEMS Packaging Book
Author : C.P. Wong,Kyoung-Sik Moon,Yi (Grace) Li
Publisher : Springer Science & Business Media
Release : 2009-12-23
ISBN : 9781441900401
Language : En, Es, Fr & De

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Book Description :

Nanotechnologies are being applied to the biotechnology area, especially in the area of nano material synthesis. Until recently, there has been little research into how to implement nano/bio materials into the device level. “Nano and Bio Electronics Packaging” discusses how nanofabrication techniques can be used to customize packaging for nano devices with applications to biological and biomedical research and products. Covering such topics as nano bio sensing electronics, bio device packaging, NEMs for Bio Devices and much more.

Nano Bio Electronic Photonic and MEMS Packaging

Nano Bio  Electronic  Photonic and MEMS Packaging Book
Author : C. P.(Ching-Ping) Wong,Kyoung-sik (Jack) Moon,Yi Li
Publisher : Springer Nature
Release : 2021-03-17
ISBN : 303049991X
Language : En, Es, Fr & De

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Book Description :

This book shows how nanofabrication techniques and nanomaterials can be used to customize packaging for nano devices with applications to electronics, photonics, biological and biomedical research and products. It covers topics such as bio sensing electronics, bio device packaging, MEMS for bio devices and much more, including: Offers a comprehensive overview of nano and bio packaging and their materials based on their chemical and physical sciences and mechanical, electrical and material engineering perspectives; Discusses nano materials as power energy sources, computational analyses of nano materials including molecular dynamic (MD) simulations and DFT calculations; Analyzes nanotubes, superhydrophobic self-clean Lotus surfaces; Covers nano chemistry for bio sensor/bio material device packaging. This second edition includes new chapters on soft materials-enabled packaging for stretchable and wearable electronics, state of the art miniaturization for active implantable medical devices, recent LED packaging and progress, nanomaterials for recent energy storage devices such as lithium ion batteries and supercapacitors and their packaging. Nano- Bio- Electronic, Photonic and MEMS Packaging is the ideal book for all biomedical engineers, industrial electronics packaging engineers, and those engaged in bio nanotechnology applications research.

Encyclopedia Of Packaging Materials Processes And Mechanics Set 1 Die attach And Wafer Bonding Technology A 4 volume Set

Encyclopedia Of Packaging Materials  Processes  And Mechanics   Set 1  Die attach And Wafer Bonding Technology  A 4 volume Set  Book
Author : Anonim
Publisher : World Scientific
Release : 2019-08-27
ISBN : 9811209642
Language : En, Es, Fr & De

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Book Description :

Packaging materials, assembly processes, and the detailed understanding of multilayer mechanics have enabled much of the progress in miniaturization, reliability, and functional density achieved by modern electronic, microelectronic, and nanoelectronic products. The design and manufacture of miniaturized packages, providing low-loss electrical and/or optical communication, while protecting the semiconductor chips from environmental stresses and internal power cycling, require a carefully balanced selection of packaging materials and processes. Due to the relative fragility of these semiconductor chips, as well as the underlying laminated substrates and the bridging interconnect, selection of the packaging materials and processes is inextricably bound with the mechanical behavior of the intimately packaged multilayer structures, in all phases of development for traditional, as well as emerging, electronic product categories.The Encyclopedia of Packaging Materials, Processes, and Mechanics, compiled in 8, multi-volume sets, provides comprehensive coverage of the configurations and techniques, assembly materials and processes, modeling and simulation tools, and experimental characterization and validation techniques for electronic packaging. Each of the volumes presents the accumulated wisdom and shared perspectives of leading researchers and practitioners in the packaging of electronic components. The Encyclopedia of Packaging Materials, Processes, and Mechanics will provide the novice and student with a complete reference for a quick ascent on the packaging 'learning curve,' the practitioner with a validated set of techniques and tools to face every challenge in packaging design and development, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in the assembly and mechanical behavior of electronic and photonic components and systems. It will be most beneficial to undergraduate and graduate students studying materials, mechanical, electrical, and electronic engineering, with a strong interest in electronic packaging applications.

Handbook of Laser Welding Technologies

Handbook of Laser Welding Technologies Book
Author : S Katayama
Publisher : Elsevier
Release : 2013-06-30
ISBN : 0857098772
Language : En, Es, Fr & De

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Book Description :

Laser welding is a rapidly developing and versatile technology which has found increasing applications in industry and manufacturing. It allows the precision welding of small and hard-to-reach areas, and is particularly suitable for operation under computer or robotic control. The Handbook of laser welding technologies reviews the latest developments in the field and how they can be used across a variety of applications. Part one provides an introduction to the fundamentals of laser welding before moving on to explore developments in established technologies including CO2 laser welding, disk laser welding and laser micro welding technology. Part two highlights laser welding technologies for various materials including aluminium and titanium alloys, plastics and glass. Part three focuses on developments in emerging laser welding technologies with chapters on the applications of robotics in laser welding and developments in the modelling and simulation of laser and hybrid laser welding. Finally, part four explores the applications of laser welding in the automotive, railway and shipbuilding industries. The Handbook of laser welding technologies is a technical resource for researchers and engineers using laser welding technologies, professionals requiring an understanding of laser welding techniques and academics interested in the field. Provides an introduction to the fundamentals of laser welding including characteristics, welding defects and evolution of laser welding Discusses developments in a number of techniques including disk, conduction and laser micro welding Focusses on technologies for particular materials such as light metal alloys, plastics and glass

Joining and Assembly of Medical Materials and Devices

Joining and Assembly of Medical Materials and Devices Book
Author : Y N Zhou,M D Breyen
Publisher : Elsevier
Release : 2013-05-31
ISBN : 0857096427
Language : En, Es, Fr & De

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Book Description :

As medical devices become more intricate, with an increasing number of components made from a wide range of materials, it is important that they meet stringent requirements to ensure that they are safe to be implanted and will not be rejected by the human body. Joining and assembly of medical materials and devices provides a comprehensive overview of joining techniques for a range of medical materials and applications. Part one provides an introduction to medical devices and joining methods with further specific chapters on microwelding methods in medical components and the effects of sterilization on medical materials and welded devices. Part two focuses on medical metals and includes chapters on the joining of shape memory alloys, platinum (Pt) alloys and stainless steel wires for implantable medical devices and evaluating the corrosion performance of metal medical device welds. Part three moves on to highlight the joining and assembly of medical plastics and discusses techniques including ultrasonic welding, transmission laser welding and radio frequency (RF)/dielectric welding. Finally, part four discusses the joining and assembly of biomaterial and tissue implants including metal-ceramic joining techniques for orthopaedic applications and tissue adhesives and sealants for surgical applications. Joining and assembly of medical materials and devices is a technical guide for engineers and researchers within the medical industry, professionals requiring an understanding of joining and assembly techniques in a medical setting, and academics interested in this field. Introduces joining methods in medical applications including microwelding and considers the effects of sterilization on the resulting joints and devices Considers the joining, assembly and corrosion performance of medical metals including shape memory alloys, platinum alloys and stainless steel wires Considers the joining and assembly of medical plastics including multiple welding methods, bonding strategies and adhesives

Engineering Steels and High Entropy Alloys

Engineering Steels and High Entropy Alloys Book
Author : Ashutosh Sharma,Sanjeev Kumar,Zoia Duriagina
Publisher : BoD – Books on Demand
Release : 2020-06-24
ISBN : 1789859476
Language : En, Es, Fr & De

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Book Description :

"This book entitled “Engineering Steels and High Entropy-Alloys” presents an overview of various types of advanced steels and high entropy alloys. It also discusses the current research trends, problems, and applications of engineering steels and high entropy materials. The book also gives a brief overview of advances in surface protection strategies of steels and laser processing of materials (additive manufacturing). The various key features of this book include: 1. A comprehensive overview of various types of engineering steels, phase transformation, and applications in engineering. 2. A complete detailed understanding and mechanism of high entropy materials, including high entropy alloys and ceramics. 3. Descriptions of structure-property relationships in high entropy materials and their application in various fields such as biomedical implants. 4. A brief review of various laser processing (additive manufacturing) and surface protection of advanced materials."

Fracture Fatigue Failure and Damage Evolution Volume 7

Fracture  Fatigue  Failure and Damage Evolution  Volume 7 Book
Author : Jay Carroll,Shuman Xia,Alison M. Beese,Ryan B. Berke,Garrett J Pataky
Publisher : Springer
Release : 2017-08-24
ISBN : 3319628313
Language : En, Es, Fr & De

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Book Description :

Fracture, Fatigue, Failure and Damage Evolution, Volume 7 of the Proceedings of the 2017 SEM Annual Conference & Exposition on Experimental and Applied Mechanics, the seventh volume of nine from the Conference, brings together contributions to this important area of research and engineering. Session organizers include: Jay Carroll, Shuman Xia, Allison Beese, Ryan Berke, Garrett Pataky, Samantha Daly, Kavan Hazeli, Antonios Kontsos, Omer Ozgur Capraz, Scott Grutzik, Onome Scott-Emaukpor The collection presents early findings and case studies on a wide range of areas, including: Mechanics of Energy & Energetic Materials Vibration Effects in Fracture & Fatigue Fracture & Fatigue of Additively Manufactured Materials In Situ Techniques for Fatigue & Fracture Microscale & Microstructural Effects on Mechanical Behavior Fracture & Fatigue of Composites Integration & Validation of Models with Experiments Fracture & Fatigue in Extreme Environments Novel Experimental Methods for Fatigue and Fracture Fracture of Brittle & Ductile Materials Interfacial Fracture

Implantable Sensor Systems for Medical Applications

Implantable Sensor Systems for Medical Applications Book
Author : Andreas Inmann,Diana Hodgins
Publisher : Elsevier
Release : 2013-01-02
ISBN : 0857096281
Language : En, Es, Fr & De

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Book Description :

Implantable sensor systems offer great potential for enhanced medical care and improved quality of life, consequently leading to major investment in this exciting field. Implantable sensor systems for medical applications provides a wide-ranging overview of the core technologies, key challenges and main issues related to the development and use of these devices in a diverse range of medical applications. Part one reviews the fundamentals of implantable systems, including materials and material-tissue interfaces, packaging and coatings, microassembly, electrode array design and fabrication, and the use of biofuel cells as sustainable power sources. Part two goes on to consider the challenges associated with implantable systems. Biocompatibility, sterilization considerations and the development of active implantable medical devices in a regulated environment are discussed, along with issues regarding data protection and patient privacy in medical sensor networks. Applications of implantable systems are then discussed in part three, beginning with Microelectromechanical systems (MEMS) for in-vivo applications before further exploration of tripolar interfaces for neural recording, sensors for motor neuroprostheses, implantable wireless body area networks and retina implants. With its distinguished editors and international team of expert contributors, Implantable sensor systems for medical applications is a comprehensive guide for all those involved in the design, development and application of these life-changing technologies. Provides a wide-ranging overview of the core technologies, key challenges and main issues related to the development and use of implantable sensor systems in a range of medical applications Reviews the fundamentals of implantable systems, including materials and material-tissue interfaces, packaging and coatings, and microassembly Considers the challenges associated with implantable systems, including biocompatibility and sterilization

Micro and Precision Manufacturing

Micro and Precision Manufacturing Book
Author : Kapil Gupta
Publisher : Springer
Release : 2017-10-15
ISBN : 3319688014
Language : En, Es, Fr & De

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Book Description :

This book provides details on various micro and precision manufacturing and finishing operations performed by conventional and advanced processes, including micro-manufacturing of micro-tools and precision finishing of engineered components. It describes the process mechanism, principles and parameters while performing micro-fabrication and precision finishing operations. The text provides the readers with knowledge of micro and precision manufacturing and encourages them to explore the future venues in this field.

Ecological Design of Smart Home Networks

Ecological Design of Smart Home Networks Book
Author : N. Saito,D Menga
Publisher : Elsevier
Release : 2015-03-31
ISBN : 1782421246
Language : En, Es, Fr & De

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Book Description :

This book provides an authoritative guide for postgraduate students and academic researchers in electronics, computer and network engineering, telecommunications, energy technology and home automation, as well as R&D managers in industrial sectors such as wireless technology, consumer electronics, telecommunications and networking, information technology, energy technology and home automation. Part One outlines the key principles and technologies needed for ecological smart home networks. Beginning with a thorough overview of the concept behind ecological smart home network design, the book reviews such important areas as power line communications, hybrid systems and middleware platforms. Part Two then goes on to discuss some important applications of this technology, with wireless smart sensor networks for home and telecare, and smart home networking for content and energy management (including the intelligent Zero Emission Urban System), all explored in detail. More systematic and comprehensive coverage: the book covers ecological design and technology requirements, performance and applications for smart home networks Better focus on industry needs: the book covers current and emerging smart home networking technologies. It explains how the technologies work, how they have developed, their capabilities and the markets that they target Better coverage of the best international research: the book is multi-contributor and brings together the leading researchers from around the world

The Welding Engineer s Guide to Fracture and Fatigue

The Welding Engineer   s Guide to Fracture and Fatigue Book
Author : Philippa L Moore,Geoff Booth
Publisher : Elsevier
Release : 2014-11-21
ISBN : 1782423915
Language : En, Es, Fr & De

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Book Description :

The Welding Engineer's Guide to Fracture and Fatigue provides an essential introduction to fracture and fatigue and the assessment of these failure modes, through to the level of knowledge that would be expected of a qualified welding engineer. Part one covers the basic principles of weld fracture and fatigue. It begins with a review of the design of engineered structures, provides descriptions of typical welding defects and how these defects behave in structures undergoing static and cyclical loading, and explains the range of failure modes. Part two then explains how to detect and assess defects using fitness for service assessment procedures. Throughout, the book assumes no prior knowledge and explains concepts from first principles. Covers the basic principles of weld fracture and fatigue. Reviews the design of engineered structures, provides descriptions of typical welding defects and how these defects behave in structures undergoing static and cyclical loading, and explains the range of failure modes. Explains how to detect and assess defects using fitness for service assessment procedures.

Welding and Joining of Advanced High Strength Steels AHSS

Welding and Joining of Advanced High Strength Steels  AHSS  Book
Author : Mahadev Shome,Muralidhar Tumuluru
Publisher : Elsevier
Release : 2015-02-25
ISBN : 0857098586
Language : En, Es, Fr & De

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Book Description :

Welding and Joining of Advanced High Strength Steels (AHSS): The Automotive Industry discusses the ways advanced high strength steels (AHSS) are key to weight reduction in sectors such as automotive engineering. It includes a discussion on how welding can alter the microstructure in the heat affected zone, producing either excessive hardening or softening, and how these local changes create potential weaknesses that can lead to failure. This text reviews the range of welding and other joining technologies for AHSS and how they can be best used to maximize the potential of AHSS. Reviews the properties and manufacturing techniques of advanced high strength steels (AHSS) Examines welding processes, performance, and fatigue in AHSS Focuses on AHSS welding and joining within the automotive industry

Remanufacturing and Advanced Machining Processes for New Materials and Components

Remanufacturing and Advanced Machining Processes for New Materials and Components Book
Author : Е.S. Gevorkyan,M. Rucki,V.P. Nerubatskyi,W. Żurowski,Z. Siemiątkowski,D. Morozow,A.G. Kharatyan
Publisher : Taylor & Francis
Release : 2022-03-22
ISBN : 1000528669
Language : En, Es, Fr & De

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Book Description :

Remanufacturing and Advanced Machining Processes for Materials and Components presents current and emerging techniques for machining of new materials and restoration of components, as well as surface engineering methods aimed at prolonging the life of industrial systems. It examines contemporary machining processes for new materials, methods of protection and restoration of components, and smart machining processes. • Details a variety of advanced machining processes, new materials joining techniques, and methods to increase machining accuracy • Presents innovative methods for protection and restoration of components primarily from the perspective of remanufacturing and protective surface engineering • Discusses smart machining processes, including computer-integrated manufacturing and rapid prototyping, and smart materials • Provides a comprehensive summary of state-of-the-art in every section and a description of manufacturing methods • Describes the applications in recovery and enhancing purposes and identifies contemporary trends in industrial practice, emphasizing resource savings and performance prolongation for components and engineering systems The book is aimed at a range of readers, including graduate-level students, researchers, and engineers in mechanical, materials, and manufacturing engineering, especially those focused on resource savings, renovation, and failure prevention of components in engineering systems.

Control of Welding Distortion in Thin Plate Fabrication

Control of Welding Distortion in Thin Plate Fabrication Book
Author : Tom Gray,D. Camilleri,N. McPherson
Publisher : Elsevier
Release : 2014-02-15
ISBN : 0857099329
Language : En, Es, Fr & De

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Book Description :

The intense temperature fields caused by heat sources in welding frequently lead to distortions and residual stresses in the finished product. Welding distortion is a particular problem in fabricating thin plate structures such as ships. Based on pioneering research by the authors, Control of Welding Distortion in Thin-Plate Fabrication reviews distortion test results from trials and shows how outcomes can be modeled computationally. The book provides readers with an understanding of distortion influences and the means to develop distortion-reducing strategies. The book is structured as an integrated treatment. It opens by reviewing the development of computational welding mechanics approaches to distortion. Following chapters describe the industrial context of stiffened plate fabrication and further chapters provide overviews of distortion mechanics and the modeling approach. A chapter on full-scale welding trials is followed by three chapters that develop modeling strategies through thermal process and thermo-mechanical simulations, based on finite-element analysis. Simplified models are a particular feature of these chapters. A final sequence of chapters explores the simulation of welding distortion in butt welding of thin plates and fillet welding of stiffened plate structures, and shows how these models can be used to optimize design and fabrication methods to control distortion. Control of Welding Distortion in Thin-Plate Fabrication is a comprehensive resource for metal fabricators, engineering companies, welders and welding companies, and practicing engineers and academics with an interest in welding mechanics. Allows practitioners in the field to minimize distortion during the welding of thin plates Provides computational tools that can give insight into the effects of welding and fabrication procedures Demonstrates how welding distortion in thin plate fabrications can be minimized through design

Advanced Manufacturing Technologies

Advanced Manufacturing Technologies Book
Author : Kapil Gupta
Publisher : Springer
Release : 2017-04-29
ISBN : 3319560999
Language : En, Es, Fr & De

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Book Description :

This book provides details and collective information on working principle, process mechanism, salient features, and unique applications of various advanced manufacturing techniques and processes belong. The book is divided in three sessions covering modern machining methods, advanced repair and joining techniques and, finally, sustainable manufacturing. The latest trends and research aspects of those fields are highlighted.