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Flash Memory Integration

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Flash Memory Integration

Flash Memory Integration Book
Author : Jalil Boukhobza,Pierre Olivier
Publisher : Elsevier
Release : 2017-03-10
ISBN : 008101158X
Language : En, Es, Fr & De

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Book Description :

4 zettabytes (4 billion terabytes) of data generated in 2013, 44 zettabytes predicted for 2020 and 185 zettabytes for 2025. These figures are staggering and perfectly illustrate this new era of data deluge. Data has become a major economic and social challenge. The speed of processing of these data is the weakest link in a computer system: the storage system. It is therefore crucial to optimize this operation. During the last decade, storage systems have experienced a major revolution: the advent of flash memory. Flash Memory Integration: Performance and Energy Issues contributes to a better understanding of these revolutions. The authors offer us an insight into the integration of flash memory in computer systems, their behavior in performance and in power consumption compared to traditional storage systems. The book also presents, in their entirety, various methods for measuring the performance and energy consumption of storage systems for embedded as well as desktop/server computer systems. We are invited on a journey to the memories of the future. Ideal for computer scientists, featuring low level details to concentrate on system issues Tackles flash memory aspects while spanning domains such as embedded systems and HPC Contains an exhaustive set of experimental results conducted in the Lab-STICC laboratory Provides details on methodologies to perform performance and energy measurements on flash storage systems

Flash Memory Integration

Flash Memory Integration Book
Author : Jalil Boukhobza
Publisher : Unknown
Release : 2017
ISBN : 0987650XXX
Language : En, Es, Fr & De

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Book Description :

Download Flash Memory Integration book written by Jalil Boukhobza, available in PDF, EPUB, and Kindle, or read full book online anywhere and anytime. Compatible with any devices.

3D Flash Memories

3D Flash Memories Book
Author : Rino Micheloni
Publisher : Springer
Release : 2016-05-26
ISBN : 9401775125
Language : En, Es, Fr & De

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Book Description :

This book walks the reader through the next step in the evolution of NAND flash memory technology, namely the development of 3D flash memories, in which multiple layers of memory cells are grown within the same piece of silicon. It describes their working principles, device architectures, fabrication techniques and practical implementations, and highlights why 3D flash is a brand new technology. After reviewing market trends for both NAND and solid state drives (SSDs), the book digs into the details of the flash memory cell itself, covering both floating gate and emerging charge trap technologies. There is a plethora of different materials and vertical integration schemes out there. New memory cells, new materials, new architectures (3D Stacked, BiCS and P-BiCS, 3D FG, 3D VG, 3D advanced architectures); basically, each NAND manufacturer has its own solution. Chapter 3 to chapter 7 offer a broad overview of how 3D can materialize. The 3D wave is impacting emerging memories as well and chapter 8 covers 3D RRAM (resistive RAM) crosspoint arrays. Visualizing 3D structures can be a challenge for the human brain: this is way all these chapters contain a lot of bird’s-eye views and cross sections along the 3 axes. The second part of the book is devoted to other important aspects, such as advanced packaging technology (i.e. TSV in chapter 9) and error correction codes, which have been leveraged to improve flash reliability for decades. Chapter 10 describes the evolution from legacy BCH to the most recent LDPC codes, while chapter 11 deals with some of the most recent advancements in the ECC field. Last but not least, chapter 12 looks at 3D flash memories from a system perspective. Is 14nm the last step for planar cells? Can 100 layers be integrated within the same piece of silicon? Is 4 bit/cell possible with 3D? Will 3D be reliable enough for enterprise and datacenter applications? These are some of the questions that this book helps answering by providing insights into 3D flash memory design, process technology and applications.

Flash Memories

Flash Memories Book
Author : Detlev Richter
Publisher : Springer Science & Business Media
Release : 2013-09-12
ISBN : 9400760825
Language : En, Es, Fr & De

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Book Description :

The subject of this book is to introduce a model-based quantitative performance indicator methodology applicable for performance, cost and reliability optimization of non-volatile memories. The complex example of flash memories is used to introduce and apply the methodology. It has been developed by the author based on an industrial 2-bit to 4-bit per cell flash development project. For the first time, design and cost aspects of 3D integration of flash memory are treated in this book. Cell, array, performance and reliability effects of flash memories are introduced and analyzed. Key performance parameters are derived to handle the flash complexity. A performance and array memory model is developed and a set of performance indicators characterizing architecture, cost and durability is defined. Flash memories are selected to apply the Performance Indicator Methodology to quantify design and technology innovation. A graphical representation based on trend lines is introduced to support a requirement based product development process. The Performance Indicator methodology is applied to demonstrate the importance of hidden memory parameters for a successful product and system development roadmap. Flash Memories offers an opportunity to enhance your understanding of product development key topics such as: · Reliability optimization of flash memories is all about threshold voltage margin understanding and definition; · Product performance parameter are analyzed in-depth in all aspects in relation to the threshold voltage operation window; · Technical characteristics are translated into quantitative performance indicators; · Performance indicators are applied to identify and quantify product and technology innovation within adjacent areas to fulfill the application requirements with an overall cost optimized solution; · Cost, density, performance and durability values are combined into a common factor – performance indicator - which fulfills the application requirements

ULSI Process Integration

ULSI Process Integration Book
Author : Cor L. Claeys
Publisher : The Electrochemical Society
Release : 1999
ISBN : 9781566772419
Language : En, Es, Fr & De

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Book Description :

Download ULSI Process Integration book written by Cor L. Claeys, available in PDF, EPUB, and Kindle, or read full book online anywhere and anytime. Compatible with any devices.

Data Intensive Storage Services for Cloud Environments

Data Intensive Storage Services for Cloud Environments Book
Author : Kyriazis, Dimosthenis
Publisher : IGI Global
Release : 2013-04-30
ISBN : 1466639350
Language : En, Es, Fr & De

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Book Description :

With the evolution of digitized data, our society has become dependent on services to extract valuable information and enhance decision making by individuals, businesses, and government in all aspects of life. Therefore, emerging cloud-based infrastructures for storage have been widely thought of as the next generation solution for the reliance on data increases. Data Intensive Storage Services for Cloud Environments provides an overview of the current and potential approaches towards data storage services and its relationship to cloud environments. This reference source brings together research on storage technologies in cloud environments and various disciplines useful for both professionals and researchers.

Digital Storage in Consumer Electronics

Digital Storage in Consumer Electronics Book
Author : Thomas M. Coughlin
Publisher : Newnes
Release : 2011-08-30
ISBN : 9780080558493
Language : En, Es, Fr & De

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Book Description :

Can you imagine life without your cell phone, laptop, digital camera, iPod, BlackBerry, flat-screen TV, or DVD player? The skyrocketing demand for devices that provide simple, immediate access to large amounts of content is driving required digital storage capacity to unprecedented levels. Designing digital storage into consumer electronics is crucial to the performance and cost of these devices. However, as our requirements for digital content storage grow, so does the formidable difficulty of implementing design solutions that are rugged, long-lasting, power-miserly, secure, network-accessible and can still fit in the palm of your hand! This book provides the background necessary to understand common digital storage devices and media. It helps readers decide which methods of storage work best for which kinds of devices, and then teaches designers how to successfully integrate them into consumer products. * Presents best practices for selecting, integrating, and using storage devices to achieve higher performance, greater reliability and lower cost * Teardown photos provide rare visuals of the "guts" of the devices discussed * Covers hot topics including flash memory, DVRs, Apple iPods, home networks, and automotive electronics, from basic layouts to standards, advanced features, and exciting growth opportunities

Embedded Flash Memory for Embedded Systems Technology Design for Sub systems and Innovations

Embedded Flash Memory for Embedded Systems  Technology  Design for Sub systems  and Innovations Book
Author : Hideto Hidaka
Publisher : Springer
Release : 2017-09-09
ISBN : 3319553062
Language : En, Es, Fr & De

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Book Description :

This book provides a comprehensive introduction to embedded flash memory, describing the history, current status, and future projections for technology, circuits, and systems applications. The authors describe current main-stream embedded flash technologies from floating-gate 1Tr, floating-gate with split-gate (1.5Tr), and 1Tr/1.5Tr SONOS flash technologies and their successful creation of various applications. Comparisons of these embedded flash technologies and future projections are also provided. The authors demonstrate a variety of embedded applications for auto-motive, smart-IC cards, and low-power, representing the leading-edge technology developments for eFlash. The discussion also includes insights into future prospects of application-driven non-volatile memory technology in the era of smart advanced automotive system, such as ADAS (Advanced Driver Assistance System) and IoE (Internet of Everything). Trials on technology convergence and future prospects of embedded non-volatile memory in the new memory hierarchy are also described. Introduces the history of embedded flash memory technology for micro-controller products and how embedded flash innovations developed; Includes comprehensive and detailed descriptions of current main-stream embedded flash memory technologies, sub-system designs and applications; Explains why embedded flash memory requirements are different from those of stand-alone flash memory and how to achieve specific goals with technology development and circuit designs; Describes a mature and stable floating-gate 1Tr cell technology imported from stand-alone flash memory products - that then introduces embedded-specific split-gate memory cell technologies based on floating-gate storage structure and charge-trapping SONOS technology and their eFlash sub-system designs; Describes automotive and smart-IC card applications requirements and achievements in advanced eFlash beyond 4 0nm node.

Flash Memories

Flash Memories Book
Author : Paulo Cappelletti,Carla Golla,Piero Olivo,Enrico Zanoni
Publisher : Springer Science & Business Media
Release : 2013-11-27
ISBN : 1461550157
Language : En, Es, Fr & De

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Book Description :

A Flash memory is a Non Volatile Memory (NVM) whose "unit cells" are fabricated in CMOS technology and programmed and erased electrically. In 1971, Frohman-Bentchkowsky developed a folating polysilicon gate tran sistor [1, 2], in which hot electrons were injected in the floating gate and removed by either Ultra-Violet (UV) internal photoemission or by Fowler Nordheim tunneling. This is the "unit cell" of EPROM (Electrically Pro grammable Read Only Memory), which, consisting of a single transistor, can be very densely integrated. EPROM memories are electrically programmed and erased by UV exposure for 20-30 mins. In the late 1970s, there have been many efforts to develop an electrically erasable EPROM, which resulted in EEPROMs (Electrically Erasable Programmable ROMs). EEPROMs use hot electron tunneling for program and Fowler-Nordheim tunneling for erase. The EEPROM cell consists of two transistors and a tunnel oxide, thus it is two or three times the size of an EPROM. Successively, the combination of hot carrier programming and tunnel erase was rediscovered to achieve a single transistor EEPROM, called Flash EEPROM. The first cell based on this concept has been presented in 1979 [3]; the first commercial product, a 256K memory chip, has been presented by Toshiba in 1984 [4]. The market did not take off until this technology was proven to be reliable and manufacturable [5].

NAND Flash Memory Technologies

NAND Flash Memory Technologies Book
Author : Seiichi Aritome
Publisher : John Wiley & Sons
Release : 2015-12-29
ISBN : 1119132606
Language : En, Es, Fr & De

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Book Description :

Offers a comprehensive overview of NAND flash memories, with insights into NAND history, technology, challenges, evolutions, and perspectives Describes new program disturb issues, data retention, power consumption, and possible solutions for the challenges of 3D NAND flash memory Written by an authority in NAND flash memory technology, with over 25 years’ experience

ULSI Process Integration 7

ULSI Process Integration 7 Book
Author : C. Claeys,H. Iwai,M. Tao,S. Deleonibus,J. Murota
Publisher : The Electrochemical Society
Release : 2011
ISBN : 1607682613
Language : En, Es, Fr & De

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Book Description :

Download ULSI Process Integration 7 book written by C. Claeys,H. Iwai,M. Tao,S. Deleonibus,J. Murota, available in PDF, EPUB, and Kindle, or read full book online anywhere and anytime. Compatible with any devices.

Inside Solid State Drives SSDs

Inside Solid State Drives  SSDs  Book
Author : Rino Micheloni,Alessia Marelli,Kam Eshghi
Publisher : Springer
Release : 2018-08-15
ISBN : 9811305994
Language : En, Es, Fr & De

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Book Description :

The revised second edition of this respected text provides a state-of-the-art overview of the main topics relating to solid state drives (SSDs), covering NAND flash memories, memory controllers (including booth hardware and software), I/O interfaces (PCIe/SAS/SATA), reliability, error correction codes (BCH and LDPC), encryption, flash signal processing and hybrid storage. Updated throughout to include all recent work in the field, significant changes for the new edition include: A new chapter on flash memory errors and data recovery procedures in SSDs for reliability and lifetime improvement Updated coverage of SSD Architecture and PCI Express Interfaces moving from PCIe Gen3 to PCIe Gen4 and including a section on NVMe over fabric (NVMf) An additional section on 3D flash memories An update on standard reliability procedures for SSDs Expanded coverage of BCH for SSDs, with a specific section on detection A new section on non-binary Low-Density Parity-Check (LDPC) codes, the most recent advancement in the field A description of randomization in the protection of SSD data against attacks, particularly relevant to 3D architectures The SSD market is booming, with many industries placing a huge effort in this space, spending billions of dollars in R&D and product development. Moreover, flash manufacturers are now moving to 3D architectures, thus enabling an even higher level of storage capacity. This book takes the reader through the fundamentals and brings them up to speed with the most recent developments in the field, and is suitable for advanced students, researchers and engineers alike.

ULSI Process Integration 5

ULSI Process Integration 5 Book
Author : Cor L. Claeys
Publisher : The Electrochemical Society
Release : 2007-01-01
ISBN : 1566775728
Language : En, Es, Fr & De

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Book Description :

The symposium provided a forum for reviewing and discussing all aspects of process integration, with special focus on nanoscaled technologies, 65 nm and beyond on DRAM, SRAM, flash memory, high density logic-low power, RF, mixed analog-digital, process integration yield, CMP chemistries, low-k processes, gate stacks, metal gates, rapid thermal processing, silicides, copper interconnects, carbon nanotubes, novel materials, high mobility substrates (SOI, sSi, SiGe, GeOI), strain engineering, and hybrid integration.

ULSI Process Integration III

ULSI Process Integration III Book
Author : Cor L. Claeys,Electrochemical Society. Electronics Division
Publisher : The Electrochemical Society
Release : 2003
ISBN : 9781566773768
Language : En, Es, Fr & De

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Book Description :

Download ULSI Process Integration III book written by Cor L. Claeys,Electrochemical Society. Electronics Division, available in PDF, EPUB, and Kindle, or read full book online anywhere and anytime. Compatible with any devices.

Solid State Electronic Devices

Solid State Electronic Devices Book
Author : Christo Papadopoulos
Publisher : Springer Science & Business Media
Release : 2013-11-19
ISBN : 1461488362
Language : En, Es, Fr & De

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Book Description :

A modern and concise treatment of the solid state electronic devices that are fundamental to electronic systems and information technology is provided in this book. The main devices that comprise semiconductor integrated circuits are covered in a clear manner accessible to the wide range of scientific and engineering disciplines that are impacted by this technology. Catering to a wider audience is becoming increasingly important as the field of electronic materials and devices becomes more interdisciplinary, with applications in biology, chemistry and electro-mechanical devices (to name a few) becoming more prevalent. Updated and state-of-the-art advancements are included along with emerging trends in electronic devices and their applications. In addition, an appendix containing the relevant physical background will be included to assist readers from different disciplines and provide a review for those more familiar with the area. Readers of this book can expect to derive a solid foundation for understanding modern electronic devices and also be prepared for future developments and advancements in this far-reaching area of science and technology.

Cleaning and Surface Conditioning Technology in Semiconductor Device Manufacturing 10

Cleaning and Surface Conditioning Technology in Semiconductor Device Manufacturing 10 Book
Author : Takeshi Hattori
Publisher : The Electrochemical Society
Release : 2007-01-01
ISBN : 156677568X
Language : En, Es, Fr & De

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Book Description :

This issue covers topics related to the removal of contaminants from and conditioning of Si (SOI), SiC, Ge, SiGe, and III-V semiconductor surfaces; cleaning media, including non-aqueous cleaning methods and tools; front- and back-end cleaning operations; integrated cleaning; cleaning of MEMS; photomasks (reticles); porous low-k dielectrics; post-CMP cleaning; wafer bevel cleaning and polishing; characterization, evaluation, and monitoring of cleaning; correlation with device performance as well as cleaning of equipment and storage and handling hardware. The hardcover edition includes a bonus CD-ROM of Cleaning Technology in Semiconductor Device Manufacturing 1989?2007: Proceedings from the ECS Semiconductor Cleaning Symposia 1?10. This bonus material is not available with the PDF edition.

ULSI Process Integration 6

ULSI Process Integration 6 Book
Author : C. Claeys
Publisher : The Electrochemical Society
Release : 2009-09
ISBN : 1566777445
Language : En, Es, Fr & De

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Book Description :

ULSI Process Integration 6 covers all aspects of process integration. Sections are devoted to 1) Device Technologies, 2) Front-end-of-line integration (gate stacks, shallow junctions, dry etching, etc.), 3) Back-end-of-line integration (CMP, low-k, Cu interconnect, air-gaps, 3D packaging, etc.), 4) Alternative channel technologies (Ge, III-V, hybrid integration), and 5) Emerging technologies (CNT, graphene, polymer electronics, nanotubes).

ULSI Process Integration 9

ULSI Process Integration 9 Book
Author : C. Claeys,J. Murota,M. Tao,H. Iwai,S. Deleonibus
Publisher : The Electrochemical Society
Release : 2015
ISBN : 1607686759
Language : En, Es, Fr & De

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Book Description :

Download ULSI Process Integration 9 book written by C. Claeys,J. Murota,M. Tao,H. Iwai,S. Deleonibus, available in PDF, EPUB, and Kindle, or read full book online anywhere and anytime. Compatible with any devices.

Silicon Based Unified Memory Devices and Technology

Silicon Based Unified Memory Devices and Technology Book
Author : Arup Bhattacharyya
Publisher : CRC Press
Release : 2017-07-06
ISBN : 1351798324
Language : En, Es, Fr & De

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Book Description :

The primary focus of this book is on basic device concepts, memory cell design, and process technology integration. The first part provides in-depth coverage of conventional nonvolatile memory devices, stack structures from device physics, historical perspectives, and identifies limitations of conventional devices. The second part reviews advances made in reducing and/or eliminating existing limitations of NVM device parameters from the standpoint of device scalability, application extendibility, and reliability. The final part proposes multiple options of silicon based unified (nonvolatile) memory cell concepts and stack designs (SUMs). The book provides Industrial R&D personnel with the knowledge to drive the future memory technology with the established silicon FET-based establishments of their own. It explores application potentials of memory in areas such as robotics, avionics, health-industry, space vehicles, space sciences, bio-imaging, genetics etc.

Integrated Interconnect Technologies for 3D Nanoelectronic Systems

Integrated Interconnect Technologies for 3D Nanoelectronic Systems Book
Author : Muhannad S. Bakir,James D. Meindl
Publisher : Artech House
Release : 2008-11-30
ISBN : 1596932473
Language : En, Es, Fr & De

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Book Description :

This cutting-edge book on off-chip technologies puts the hottest breakthroughs in high-density compliant electrical interconnects, nanophotonics, and microfluidics at your fingertips, integrating the full range of mathematics, physics, and technology issues together in a single comprehensive source. You get full details on state-of-the-art I/O interconnects and packaging, including mechanically compliant I/O approaches, fabrication, and assembly, followed by the latest advances and applications in power delivery design, analysis, and modeling. The book explores interconnect structures, materials, and packages for achieving high-bandwidth off-chip electrical communication, including optical interconnects and chip-to-chip signaling approaches, and brings you up to speed on CMOS integrated optical devices, 3D integration, wafer stacking technology, and through-wafer interconnects.